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NCN6000DTBR2G

Onsemi

NCN6000DTBR2G by Onsemi

The Onsemi NCN6000DTBR2G is a consumer IC with 20 terminals in a small outline, thin profile package. It operates b/w -25 °C to 85°C and supports supply voltages from 2.7V to 6V. Ideal for applications requiring compact design and surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,559 parts In-Stock

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8,559

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Pegasus Components GmbH

Germany . 3,960 parts In-Stock

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3,960

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Digiode

USA . 2,004 parts In-Stock

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2,004

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Distributors (Availability)

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Component Stockers USA

USA . 1,122 parts In-Stock

1+ parts

$1.660

100+ parts

$1.570

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$1.660

$1.570

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Benley Electronics

USA . 4 parts In-Stock

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$2.000

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4

$2.000

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Modulus Dynamics

Lithuania . 50 parts In-Stock

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$2.286

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$2.286

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$2.286

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50

$2.286

$2.286

$2.286

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AZTECH Wire

Italy . 1,111 parts In-Stock

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$13.340

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1,111

$13.340

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QUARKTWIN TECHNOLOGY LTD

USA . 18,874 parts In-Stock

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TANS Electronics

Latvia . 7,730 parts In-Stock

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Kulean Microsystems

USA . 7,261 parts In-Stock

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Microchip USA

USA . 4,118 parts In-Stock

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Problanco Electronics

Mexico . 2,908 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Corphita

USA . 2,084 parts In-Stock

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Kepictronics

USA . 1,654 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Metaverse IC Inc.

Canada . 1,021 parts In-Stock

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1,021

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Corohmni

South Africa . 400 parts In-Stock

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400

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UHIMA Technologies

Türkiye . 389 parts In-Stock

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389

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SupplyDigital Components

Austria . 287 parts In-Stock

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287

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Overview

Enhance your consumer electronic devices with the NCN6000DTBR2G by Onsemi. Designed by a reputable manufacturer, this innovative product falls under the category of Other Function Consumer ICs, offering reliability and high performance. With its sleek rectangular package body material and surface mount feature, this IC is perfect for a wide range of applications. Experience the value of seamless integration and improved functionality that this product brings to your projects. Trust Onsemi to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape is common and easy to handle, ensuring compatibility with standard PCB designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows for use in a wide range of environments, including cold temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Width: 4.4 mm

Compact width allows for efficient use of space on the circuit board, particularly important for applications with size constraints.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement enables the product to operate in environments with limited power availability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper soldering during assembly, reducing the risk of soldering defects.

Terminal Pitch: 0.65 mm

Small terminal pitch allows for a high terminal density, contributing to compact design and efficient use of PCB real estate.

Technical Specifications

Other Function Consumer ICs NCN6000DTBR2G attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NCN6000DTBR2G General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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