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NCN6000DTB

Onsemi

NCN6000DTB by Onsemi

The Onsemi NCN6000DTB is a consumer IC with 20 terminals in a small outline, thin profile package. It operates b/w -25 °C to 85°C, with supply voltage ranging from 2.7V to 6V and max current of 5mA. Ideal for applications requiring compact design and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,875 parts In-Stock

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4,875

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Digiode

USA . 1,250 parts In-Stock

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1,250

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PC Components Company LLC

USA . 23 parts In-Stock

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23

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Bristol Electronics

USA . 23 parts In-Stock

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AZTECH Wire

Italy . 918 parts In-Stock

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$21.690

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918

$21.690

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Component Stockers USA

USA . 406 parts In-Stock

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$99.990

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Kepictronics

USA . 66,131 parts In-Stock

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Metaverse IC Inc.

Canada . 61,181 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,929 parts In-Stock

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TANS Electronics

Latvia . 8,037 parts In-Stock

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8,037

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Kulean Microsystems

USA . 3,578 parts In-Stock

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Corphita

USA . 1,746 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Assy Fe

Spain . 1,143 parts In-Stock

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SupplyDigital Components

Austria . 1,052 parts In-Stock

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Perfect Parts

USA . 504 parts In-Stock

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UHIMA Technologies

Türkiye . 437 parts In-Stock

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Corohmni

South Africa . 343 parts In-Stock

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343

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Problanco Electronics

Mexico . 249 parts In-Stock

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249

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Microchip USA

USA . 241 parts In-Stock

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241

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Overview

Elevate your consumer circuit designs with the NCN6000DTB by Onsemi. Crafted from high-quality materials and boasting a compact design, this IC offers unmatched reliability and performance. Ideal for a wide range of applications, this product is a game-changer in the electronics industry. Experience seamless integration, enhanced efficiency, and top-notch results with the NCN6000DTB. Upgrade your projects today and see the difference that Onsemi's expertise and innovation can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing overall component cost.

Minimum Operating Temperature: -25 °C

The wide temperature range of -25 to 85 °C ensures the product can operate in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall performance and reliability of the product.

Width: 4.4 mm

The compact width of 4.4 mm allows for space-saving integration into smaller electronic devices or circuit designs.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage of 2.7 V ensures compatibility with a wide range of power sources and helps in reducing power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time of 30 seconds helps in achieving proper soldering during assembly, improving product quality and reliability.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting, making this product suitable for compact electronic designs.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6 V provides flexibility in power input options while ensuring safe operation within specified limits.

Technical Specifications

Other Function Consumer ICs NCN6000DTB attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NCN6000DTB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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