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NB4N527SMNR2

Onsemi

NB4N527SMNR2 by Onsemi

NB4N527SMNR2 by Onsemi is a 16-terminal interface IC with a supply voltage range of 3-3.6V, operating temperature from -40 to 85 °C, and max seated height of 1mm. It is designed for industrial applications requiring fast signal processing with a max receive delay of 0.47ns and low supply current draw of 53mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,085 parts In-Stock

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6,085

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Digiode

USA . 2,460 parts In-Stock

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2,460

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Distributors (Availability)

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AZTECH Wire

Italy . 662 parts In-Stock

1+ parts

$15.910

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662

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Kulean Microsystems

USA . 7,710 parts In-Stock

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7,710

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Problanco Electronics

Mexico . 7,658 parts In-Stock

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TANS Electronics

Latvia . 4,153 parts In-Stock

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SupplyDigital Components

Austria . 2,750 parts In-Stock

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2,750

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Corohmni

South Africa . 404 parts In-Stock

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404

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UHIMA Technologies

Türkiye . 155 parts In-Stock

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Corphita

USA . 131 parts In-Stock

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Microchip USA

USA . 125 parts In-Stock

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Overview

Enhance your electronic devices with the NB4N527SMNR2 by Onsemi, a premium Other Function Interface IC that guarantees top-notch quality and reliability. Manufactured by industry leader Onsemi, this surface mount chip offers unparalleled performance in various applications. With a wide operating temperature range, low supply voltage, and high-speed data transmission capabilities, this product delivers exceptional value and benefits to customers looking for cutting-edge interface solutions. Upgrade your electronics today with the NB4N527SMNR2 and experience unmatched efficiency and precision.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Can handle a high supply voltage, making it suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB real estate and easy orientation during assembly.

Power Supplies (V): 3.3

Operates at a common supply voltage, ensuring compatibility with many systems.

No. of Terminals: 16

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style options to suit different application requirements and thermal considerations.

Minimum Supply Voltage: 3 V

Can operate at a low supply voltage, saving power and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold conditions, providing robust performance in various environments.

Terminal Finish: TIN LEAD

Tin lead finish facilitates soldering and provides good electrical conductivity for reliable connections.

Terminal Position: QUAD

Quad terminal position enhances stability and ensures secure connection to the PCB.

Maximum Seated Height: 1 mm

Low seated height for space-constrained applications.

Width: 3 mm

Compact width for easy integration into tight spaces on the PCB.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during assembly processes.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Maximum Receive Delay: 0.47 ns

Low receive delay for fast and efficient data processing.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of lead contamination and is environmentally friendly.

Maximum Supply Current: 53 mA

Low supply current for efficient power consumption.

Nominal Supply Voltage: 3.3 V

Stable and common supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and high-density mounting.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, ensuring optimal performance and compatibility.

Technical Specifications

Other Function Interface ICs NB4N527SMNR2 attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.47 ns

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

53 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB4N527SMNR2 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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