Loading...

NB4N527SMNR2G

Onsemi

NB4N527SMNR2G by Onsemi

NB4N527SMNR2G by Onsemi is a 16-terminal interface IC with a supply voltage range of 3-3.6V, operating temperature from -40 to 85°C, and max seated height of 1mm. It is designed for industrial applications requiring fast signal processing with features like a peak reflow temperature of 260°C and low receive delay of 0.47ns.

Median Price

$13.550

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 608 parts In-Stock

1+ parts

$13.550

100+ parts

$9.440

1k+ parts

$8.940

10k+ parts

$8.150

608

$13.550

$9.440

$8.940

$8.150

DigiKey

USA . 131 parts In-Stock

1+ parts

$13.550

100+ parts

$9.430

1k+ parts

-

10k+ parts

$8.156

131

$13.550

$9.430

-

$8.156

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,775

-

-

-

-

Vyrian

USA . 1,098 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,098

-

-

-

-

SPM Sales

USA . 229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

229

-

-

-

-

Nova Conductors

Japan . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

Semtec, LLC

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,630 parts In-Stock

1+ parts

$12.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,630

$12.500

-

-

-

Component Stockers USA

USA . 2,448 parts In-Stock

1+ parts

$12.560

100+ parts

$9.280

1k+ parts

$7.660

10k+ parts

-

2,448

$12.560

$9.280

$7.660

-

Microchip USA

USA . 4,891 parts In-Stock

1+ parts

$23.415

100+ parts

-

1k+ parts

-

10k+ parts

-

4,891

$23.415

-

-

-

TANS Electronics

Latvia . 7,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,890

-

-

-

-

Kulean Microsystems

USA . 6,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,398

-

-

-

-

SupplyDigital Components

Austria . 4,467 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,467

-

-

-

-

Problanco Electronics

Mexico . 3,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,962

-

-

-

-

Perfect Parts

USA . 2,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,788

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

UHIMA Technologies

Türkiye . 564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

564

-

-

-

-

Corohmni

South Africa . 437 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

437

-

-

-

-

Corphita

USA . 365 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

365

-

-

-

-

Overview

Elevate your electronic designs with the NB4N527SMNR2G by Onsemi, setting new standards in quality and reliability. Crafted by the renowned manufacturer Onsemi, this interface IC boasts a wide range of applications in various industries. From its surface mount capability to its robust construction, this product delivers unparalleled performance and value to customers. Experience seamless integration, enhanced functionality, and superior efficiency with the NB4N527SMNR2G - truly a game-changer in the world of electronic components.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting onto a circuit board, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of input voltages, making it versatile and compatible with various systems.

Package Shape: SQUARE

Square package shape allows for easy placement and alignment on the circuit board, optimizing space usage.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage, ensuring stable performance.

No. of Terminals: 16

Sufficient number of terminals for the required connections, offering flexibility in interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles provide different options for thermal management and space constraints, catering to specific design needs.

Minimum Supply Voltage: 3 V

Can operate at low voltages, offering energy efficiency and compatibility with different power sources.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, ensuring reliability in harsh operating conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments, expanding its usability.

Terminal Finish: NICKEL GOLD PALLADIUM

Durable terminal finish for reliable and long-lasting connections, reducing the risk of corrosion or signal degradation.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection, minimizing the risk of signal interference or disconnection.

Maximum Seated Height: 1 mm

Low profile design saves space and allows for compact integration in electronic devices.

Width: 3 mm

Compact width size enables efficient placement and arrangement on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for effective soldering and bonding during assembly process.

Length: 3 mm

Optimal length size for easy integration and compatibility with standard board dimensions.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature environments, suitable for a wide range of applications.

Maximum Receive Delay: 0.47 ns

Low receive delay ensures fast and efficient signal processing, enhancing overall performance.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance and safety in electronic manufacturing.

Maximum Supply Current: 53 mA

Low supply current consumption for energy efficiency and extended battery life in portable devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent and reliable operation in various applications.

Terminal Pitch: 0.5 mm

Optimal terminal pitch for efficient connection and compatibility with standard board layouts.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications, ensuring accurate signal processing and communication between components.

Technical Specifications

Other Function Interface ICs NB4N527SMNR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.47 ns

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

53 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB4N527SMNR2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5