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NB4N855SMR4G

Onsemi

NB4N855SMR4G by Onsemi

NB4N855SMR4G by Onsemi is a small outline, thin profile interface IC with 10 terminals and a supply voltage of 3.3V. It operates in industrial temperatures from -40 to 85°C, making it suitable for various applications requiring precise signal interfacing in compact electronic devices. With matte tin terminal finish and gull wing form, this IC offers reliable performance in surface-mount configurations.

Median Price

$13.895

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 914 parts In-Stock

1+ parts

$13.800

100+ parts

$9.540

1k+ parts

$7.620

10k+ parts

-

914

$13.800

$9.540

$7.620

-

Arrow

USA . 1,000 parts In-Stock

1+ parts

$13.895

100+ parts

$9.646

1k+ parts

$8.655

10k+ parts

-

1,000

$13.895

$9.646

$8.655

-

Verical

USA . 1,000 parts In-Stock

1+ parts

$13.895

100+ parts

$9.646

1k+ parts

$8.655

10k+ parts

-

1,000

$13.895

$9.646

$8.655

-

DigiKey

USA . 2,584 parts In-Stock

1+ parts

$14.690

100+ parts

$10.299

1k+ parts

$9.142

10k+ parts

-

2,584

$14.690

$10.299

$9.142

-

Mouser Electronics

USA . 1,127 parts In-Stock

1+ parts

$14.690

100+ parts

$10.300

1k+ parts

$9.110

10k+ parts

-

1,127

$14.690

$10.300

$9.110

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 869 parts In-Stock

1+ parts

$7.581

100+ parts

-

1k+ parts

-

10k+ parts

-

869

$7.581

-

-

-

Vyrian

USA . 1,377 parts In-Stock

1+ parts

$7.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,377

$7.980

-

-

-

Flip Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Mil-Aero Solutions, Inc.

USA . 3,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,776

-

-

-

-

Semi Source

USA . 55 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

55

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 362 parts In-Stock

1+ parts

$7.150

100+ parts

-

1k+ parts

-

10k+ parts

-

362

$7.150

-

-

-

Corphita

USA . 2,032 parts In-Stock

1+ parts

$7.182

100+ parts

-

1k+ parts

-

10k+ parts

-

2,032

$7.182

-

-

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Perfect Parts

USA . 6,994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,994

-

-

-

-

TANS Electronics

Latvia . 4,538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,538

-

-

-

-

Problanco Electronics

Mexico . 3,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,287

-

-

-

-

Lixinc

USA . 2,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,673

-

-

-

-

SupplyDigital Components

Austria . 1,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,880

-

-

-

-

Kulean Microsystems

USA . 1,712 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,712

-

-

-

-

Kepictronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

UHIMA Technologies

Türkiye . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Overview

Enhance your electronic devices with the NB4N855SMR4G by Onsemi, a top-quality Other Function Interface IC that offers unparalleled performance and reliability. Onsemi, a renowned manufacturer in the industry, ensures that this product meets the highest standards of quality and durability. With its versatile applications and advanced features, this interface circuit IC provides exceptional value and benefits to customers looking for seamless integration and optimal functionality in their designs. Upgrade your technology with Onsemi's NB4N855SMR4G and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and cost-effective, making it a suitable choice for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage provides flexibility in power requirements for different applications.

Package Shape: SQUARE

Square shape helps optimize space utilization on the PCB.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance of the interface IC.

No. of Terminals: 10

A higher number of terminals allow for more connectivity options and functions in the IC.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and enhances overall design efficiency.

Minimum Supply Voltage: 3 V

Low minimum supply voltage helps in energy-efficient operation of the IC.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability under various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting and connection options on the PCB.

Maximum Seated Height: 1.1 mm

Low seated height helps in compact design and space-saving on the PCB.

Width: 3 mm

Narrow width makes it suitable for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with a short reflow time ensures quick and reliable assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliable connections.

Length: 3 mm

Short length helps in optimizing space utilization on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure PCB mounting.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance of the IC.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and interconnection for efficient PCB design.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, this IC provides reliable communication between different components.

Technical Specifications

Other Function Interface ICs NB4N855SMR4G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB4N855SMR4G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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