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NB3U23CSQTCG

Onsemi

NB3U23CSQTCG by Onsemi

NB3U23CSQTCG clock driver by Onsemi features 2 functions, 5ns propagation delay, and operates in a temperature range of -40 to 85 °C. It is designed for industrial applications requiring a small outline package with a thin profile and shrink pitch.

Median Price

$1.414

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,423 parts In-Stock

1+ parts

$2.210

100+ parts

$1.500

1k+ parts

$1.020

10k+ parts

$0.927

2,423

$2.210

$1.500

$1.020

$0.927

DigiKey

USA . 319,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.190

10k+ parts

$1.190

319,031

-

-

$1.190

$1.190

Rochester

USA . 310,499 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.150

10k+ parts

$1.030

310,499

-

$1.390

$1.150

$1.030

Verical

USA . 179,211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

$1.288

179,211

-

-

$1.438

$1.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 503 parts In-Stock

1+ parts

$1.083

100+ parts

-

1k+ parts

-

10k+ parts

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503

$1.083

-

-

-

Vyrian

USA . 521 parts In-Stock

1+ parts

$1.140

100+ parts

-

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10k+ parts

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521

$1.140

-

-

-

Netsource Technology, Inc.

USA . 1,046 parts In-Stock

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1,046

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 895 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

-

10k+ parts

-

895

$1.026

-

-

-

Corohmni

South Africa . 420 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

-

420

$1.190

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 27,298 parts In-Stock

1+ parts

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27,298

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Microchip USA

USA . 7,332 parts In-Stock

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7,332

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Perfect Parts

USA . 6,804 parts In-Stock

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6,804

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TANS Electronics

Latvia . 5,961 parts In-Stock

1+ parts

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5,961

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-

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Speed Components Ltd (Excess)

Israel . 3,072 parts In-Stock

1+ parts

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3,072

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 2,696 parts In-Stock

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2,696

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Kulean Microsystems

USA . 1,526 parts In-Stock

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1,526

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Problanco Electronics

Mexico . 269 parts In-Stock

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269

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UHIMA Technologies

Türkiye . 87 parts In-Stock

1+ parts

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87

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Overview

Unleash the power of precision with the NB3U23CSQTCG by Onsemi. Designed for clock drivers and buffers, this product offers unmatched quality and reliability. With a wide range of applications, this small outline, thin profile package is perfect for industrial use. Experience lightning-fast propagation delay and standard input conditioning, providing seamless performance in any setting. Trust in Onsemi's reputable manufacturing to deliver exceptional value and benefits, making the NB3U23CSQTCG a must-have for your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in protecting internal components of the clock driver/buffer.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto circuit boards, saving space and simplifying assembly.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making this clock driver/buffer versatile.

No. of Functions: 2

Having multiple functions in a single component reduces component count on the board, leading to cost savings and improved efficiency.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB and facilitates easy placement during assembly.

Nominal Supply Voltage / Vsup (V): 1.2

Operating at a nominal supply voltage of 1.2V ensures compatibility in a variety of applications while maintaining energy efficiency.

Propagation Delay (tpd): 5 ns

Low propagation delay of 5ns ensures minimal delay in signal transmission, making this clock driver/buffer suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C, this clock driver/buffer is ideal for use in harsh environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals provides good solderability and ensures reliable connections during assembly.

Terminal Position: DUAL

Dual terminal position allows for flexible placement on the PCB, accommodating different layout requirements.

Width: 1.25 mm

Compact width of 1.25mm enables space-efficient design and integration of this clock driver/buffer into tight layouts.

Minimum Supply Voltage (Vsup): 1.14 V

Operating at a minimum supply voltage of 1.14V ensures compatibility with low-power systems, enhancing energy efficiency.

Peak Reflow Temperature °C: 260

With peak reflow temperature reaching 260 °C, this clock driver/buffer can withstand high-temperature soldering processes.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures reliable operation in demanding industrial environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and offers mechanical stability for the clock driver/buffer.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this product allows for precise and compact placement of terminals on the PCB.

Maximum Supply Voltage (Vsup): 1.26 V

Operating at a maximum supply voltage of 1.26V ensures protection against voltage spikes and overvoltage conditions, enhancing reliability.

Technical Specifications

Clock Drivers & Buffers NB3U23CSQTCG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

6

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

5 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

1.14 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NB3U23CSQTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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