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NB3U23CMNTBG

Onsemi

NB3U23CMNTBG by Onsemi

NB3U23CMNTBG clock driver by Onsemi features 2 functions, 5ns propagation delay, and operates in a temperature range of -40 to 85 °C. It is used for clock distribution in industrial applications with a supply voltage range of 1.14V to 1.26V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,827 parts In-Stock

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Vyrian

USA . 496 parts In-Stock

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496

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Distributors (Availability)

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SupplyDigital Components

Austria . 7,472 parts In-Stock

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7,472

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Problanco Electronics

Mexico . 6,671 parts In-Stock

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TANS Electronics

Latvia . 1,757 parts In-Stock

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1,757

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Corphita

USA . 1,702 parts In-Stock

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Kulean Microsystems

USA . 290 parts In-Stock

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290

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Corohmni

South Africa . 214 parts In-Stock

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UHIMA Technologies

Türkiye . 161 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NB3U23CMNTBG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Clock Drivers & Buffers that offer unmatched reliability and precision. Ideal for a wide range of applications, this product ensures seamless signal transmission and synchronization. With its compact design and industrial-grade temperature tolerance, the NB3U23CMNTBG is a valuable asset for any project. Upgrade your systems with this innovative solution and experience the enhanced efficiency it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and light, making the product robust and easy to handle.

Surface Mount: YES

Surface mount capability allows for easy installation and saves space on the PCB.

Nominal Supply Voltage / Vsup (V): 1.2

Operating at a low nominal supply voltage of 1.2V means the product is energy efficient.

Propagation Delay (tpd): 5 ns

With a low propagation delay of 5ns, this product ensures fast and efficient signal transmission.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows for reliable performance even in harsh environments.

Technical Specifications

Clock Drivers & Buffers NB3U23CMNTBG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-N6

Length:

1.4 mm

Logic IC Type:

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

6

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

5 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

1.14 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.2 mm

Trade Compliance

NB3U23CMNTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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