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NB3U1548CDTR2G

Onsemi

NB3U1548CDTR2G by Onsemi

NB3U1548CDTR2G clock driver by Onsemi features 3.5ns propagation delay, 4 true outputs, and a min fmax of 160MHz. Ideal for industrial applications requiring precise timing control in compact spaces with a temperature range of -40 to 85°C.

Median Price

$5.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,772 parts In-Stock

1+ parts

$5.690

100+ parts

$3.656

1k+ parts

$3.618

10k+ parts

$3.197

2,772

$5.690

$3.656

$3.618

$3.197

Mouser Electronics

USA . 1,886 parts In-Stock

1+ parts

$5.690

100+ parts

$3.660

1k+ parts

$3.470

10k+ parts

$3.180

1,886

$5.690

$3.660

$3.470

$3.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.595

100+ parts

-

1k+ parts

-

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-

150

$3.595

-

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Digiode

USA . 1,633 parts In-Stock

1+ parts

$6.792

100+ parts

-

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1,633

$6.792

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Vyrian

USA . 3,316 parts In-Stock

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3,316

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.595

100+ parts

-

1k+ parts

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-

1,000

$3.595

-

-

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Ampacity Inc.

Singapore . 2,557 parts In-Stock

1+ parts

$6.110

100+ parts

-

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2,557

$6.110

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Corphita

USA . 203 parts In-Stock

1+ parts

$6.435

100+ parts

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203

$6.435

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-

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Corohmni

South Africa . 441 parts In-Stock

1+ parts

$7.150

100+ parts

-

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441

$7.150

-

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Microchip USA

USA . 4,980 parts In-Stock

1+ parts

$21.670

100+ parts

$21.540

1k+ parts

$21.470

10k+ parts

$21.410

4,980

$21.670

$21.540

$21.470

$21.410

Kulean Microsystems

USA . 7,935 parts In-Stock

1+ parts

-

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7,935

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SupplyDigital Components

Austria . 7,604 parts In-Stock

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7,604

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TANS Electronics

Latvia . 7,036 parts In-Stock

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7,036

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Alle Elektronik GmbH

Germany . 2,338 parts In-Stock

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2,338

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Problanco Electronics

Mexico . 2,337 parts In-Stock

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2,337

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UHIMA Technologies

Türkiye . 336 parts In-Stock

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336

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Overview

Discover the ultimate precision and reliability with the NB3U1548CDTR2G by Onsemi. As a leading manufacturer in clock drivers & buffers, Onsemi delivers top-notch quality in a compact package. This versatile product is ideal for a wide range of applications, providing customers with seamless performance and efficiency. Experience the value and benefits that Onsemi brings to the table with the NB3U1548CDTR2G, offering unparalleled advantages that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the clock driver, ensuring reliable performance over time.

Input Conditioning: STANDARD

Standard input conditioning allows for compatibility with various input signals, making this clock driver suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage allows for efficient power consumption and compatibility with standard voltage levels in electronic systems.

Propagation Delay (tpd): 3.5 ns

With a fast propagation delay of 3.5ns, this clock driver ensures timely and accurate signal transmission, making it ideal for high-speed applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of this clock driver allows it to operate reliably in a wide range of temperature conditions, making it suitable for industrial applications.

Minimum fmax: 160 MHz

The minimum frequency capability of 160MHz ensures that this clock driver can handle high frequencies, making it suitable for applications requiring fast data processing.

Technical Specifications

Clock Drivers & Buffers NB3U1548CDTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.5 ns

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

160 MHz

Trade Compliance

NB3U1548CDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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