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NB2309AI1HDG

Onsemi

NB2309AI1HDG by Onsemi

NB2309AI1HDG Clock Driver by Onsemi operates at 3.3V, with 8 true outputs and a max frequency of 133.33MHz. Ideal for industrial applications, it features a small outline package style and Gull Wing terminal form for efficient surface mounting.

Median Price

$0.606

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,615 parts In-Stock

1+ parts

-

100+ parts

$0.595

1k+ parts

$0.493

10k+ parts

$0.440

9,615

-

$0.595

$0.493

$0.440

Verical

USA . 6,853 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.617

10k+ parts

$0.550

6,853

-

-

$0.617

$0.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,259 parts In-Stock

1+ parts

$0.463

100+ parts

-

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1,259

$0.463

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Vyrian

USA . 10,441 parts In-Stock

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10,441

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LWI Electronics Inc

India . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,380 parts In-Stock

1+ parts

$0.438

100+ parts

-

1k+ parts

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1,380

$0.438

-

-

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Corohmni

South Africa . 465 parts In-Stock

1+ parts

$0.441

100+ parts

-

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465

$0.441

-

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-

AZTECH Wire

Italy . 606 parts In-Stock

1+ parts

$20.060

100+ parts

-

1k+ parts

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606

$20.060

-

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QUARKTWIN TECHNOLOGY LTD

USA . 12,318 parts In-Stock

1+ parts

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12,318

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Continental Prestige Electronics

USA . 10,140 parts In-Stock

1+ parts

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100+ parts

$0.415

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10,140

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$0.415

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TANS Electronics

Latvia . 8,354 parts In-Stock

1+ parts

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8,354

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 4,105 parts In-Stock

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Microchip USA

USA . 4,046 parts In-Stock

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4,046

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Problanco Electronics

Mexico . 954 parts In-Stock

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954

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Perfect Parts

USA . 606 parts In-Stock

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606

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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303

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SupplyDigital Components

Austria . 276 parts In-Stock

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276

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Overview

Experience the superior quality and reliability of the NB2309AI1HDG clock driver & buffer by Onsemi. With a reputation for excellence, Onsemi delivers cutting-edge technology in a small outline package that meets industrial temperature grades. Ideal for a wide range of applications, this product offers customers peace of mind with its 3-STATE output characteristics and standard input conditioning. Trust Onsemi to provide the best solutions for your clock driver needs, ensuring optimal performance and efficiency every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard voltage levels in electronic devices, ensuring seamless integration.

Maximum Operating Temperature: 85 °C

Can operate efficiently in a wide range of temperatures, making it suitable for various industrial applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Clock Drivers & Buffers NB2309AI1HDG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2309

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

133.33 MHz

Trade Compliance

NB2309AI1HDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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