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NB2308AI1DTR2G

Onsemi

NB2308AI1DTR2G by Onsemi

NB2308AI1DTR2G clock driver by Onsemi operates at 3.3V, with 16 terminals and a max I (ol) of 8A. It features a small outline package style and is suitable for industrial applications requiring a CMOS technology clock driver with 3-STATE output characteristics up to 133.3MHz frequency.

Median Price

$0.606

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 27,792 parts In-Stock

1+ parts

-

100+ parts

$0.595

1k+ parts

$0.493

10k+ parts

$0.440

27,792

-

$0.595

$0.493

$0.440

Verical

USA . 25,367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.617

10k+ parts

$0.550

25,367

-

-

$0.617

$0.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,713 parts In-Stock

1+ parts

$0.463

100+ parts

-

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1,713

$0.463

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Vyrian

USA . 2,384 parts In-Stock

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2,384

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Distributors (Availability)

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Corphita

USA . 923 parts In-Stock

1+ parts

$0.438

100+ parts

-

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923

$0.438

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Corohmni

South Africa . 481 parts In-Stock

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$0.441

100+ parts

-

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481

$0.441

-

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-

Component Stockers USA

USA . 22,222 parts In-Stock

1+ parts

$0.500

100+ parts

$0.470

1k+ parts

$0.420

10k+ parts

$0.420

22,222

$0.500

$0.470

$0.420

$0.420

AZTECH Wire

Italy . 601 parts In-Stock

1+ parts

$12.180

100+ parts

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601

$12.180

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Continental Prestige Electronics

USA . 27,792 parts In-Stock

1+ parts

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100+ parts

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$0.415

10k+ parts

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27,792

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-

$0.415

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QUARKTWIN TECHNOLOGY LTD

USA . 15,775 parts In-Stock

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Problanco Electronics

Mexico . 8,192 parts In-Stock

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SupplyDigital Components

Austria . 7,726 parts In-Stock

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Microchip USA

USA . 4,541 parts In-Stock

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4,541

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TANS Electronics

Latvia . 3,758 parts In-Stock

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Kulean Microsystems

USA . 1,633 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 536 parts In-Stock

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536

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Overview

Enhance the performance of your electronic devices with the NB2308AI1DTR2G clock driver from Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that guarantee reliability and efficiency. Clock drivers play a crucial role in ensuring proper synchronization and timing in various applications, making this product essential for smooth operations. With features like a small outline package and a wide temperature range, the NB2308AI1DTR2G offers unmatched value and benefits to customers looking for a dependable solution. Upgrade your devices today and experience the difference with Onsemi's clock drivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver and buffer, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and convenient installation on a PCB, saving space and making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, ensuring compatibility with a wide range of applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments with demanding thermal conditions.

Output Characteristics: 3-STATE

Offers three possible output states, providing flexibility and control over the output signals.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing the efficiency and reliability of the device.

Technical Specifications

Clock Drivers & Buffers NB2308AI1DTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2308

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

133.3 MHz

Trade Compliance

NB2308AI1DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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