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NB2308AC3DR2

Onsemi

NB2308AC3DR2 by Onsemi

NB2308AC3DR2 clock driver by Onsemi operates at 3.3V, with 16 terminals and a max I (ol) of 8A. It features a small outline package style and is suitable for applications requiring a max operating temperature of 70 °C, such as in commercial-grade CMOS technology setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,638 parts In-Stock

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Digiode

USA . 834 parts In-Stock

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834

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AZTECH Wire

Italy . 233 parts In-Stock

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$12.190

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$12.190

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Ampacity Inc.

Singapore . 229 parts In-Stock

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$38.000

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Kulean Microsystems

USA . 6,634 parts In-Stock

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Microchip USA

USA . 4,211 parts In-Stock

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TANS Electronics

Latvia . 3,953 parts In-Stock

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Corphita

USA . 2,029 parts In-Stock

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SupplyDigital Components

Austria . 497 parts In-Stock

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Problanco Electronics

Mexico . 386 parts In-Stock

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UHIMA Technologies

Türkiye . 338 parts In-Stock

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Corohmni

South Africa . 306 parts In-Stock

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Overview

Enhance your electronic designs with the NB2308AC3DR2 by Onsemi, a high-quality clock driver and buffer that offers impeccable performance and reliability. Manufactured by industry leader Onsemi, this product is designed to meet the highest standards, making it perfect for a wide range of applications. Experience seamless operation and enhanced functionality with this innovative solution. Upgrade your projects today with the NB2308AC3DR2 and enjoy the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making the product suitable for various operating conditions.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a common voltage level, ensuring compatibility with other components in the system.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for use in industrial or automotive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Clock Drivers & Buffers NB2308AC3DR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2308

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

133.3 MHz

Trade Compliance

NB2308AC3DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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