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N25S830HAT22IT

Onsemi

N25S830HAT22IT by Onsemi

N25S830HAT22IT by Onsemi is a 32KX8 SRAM with synchronous operation and 3-STATE output. It operates at a max clock frequency of 20 MHz, suitable for industrial applications requiring fast and reliable memory access. With a small outline package and thin profile, it is ideal for space-constrained designs in various electronic devices.

Median Price

$1.765

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,910 parts In-Stock

1+ parts

$1.145

100+ parts

-

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10k+ parts

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2,910

$1.145

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Chip1Stop

Japan . 5,525 parts In-Stock

1+ parts

$1.570

100+ parts

$1.207

1k+ parts

$1.173

10k+ parts

-

5,525

$1.570

$1.207

$1.173

-

Mouser Electronics

USA . 5,475 parts In-Stock

1+ parts

$1.960

100+ parts

$1.740

1k+ parts

$1.650

10k+ parts

$1.400

5,475

$1.960

$1.740

$1.650

$1.400

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$2.380

100+ parts

$2.066

1k+ parts

$1.905

10k+ parts

$1.427

3,000

$2.380

$2.066

$1.905

$1.427

Verical

USA . 2,910 parts In-Stock

1+ parts

-

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-

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2,910

-

-

-

-

Distributors (In-Stock)

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Vyrian

USA . 340 parts In-Stock

1+ parts

$1.207

100+ parts

-

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340

$1.207

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Digiode

USA . 1,095 parts In-Stock

1+ parts

$1.249

100+ parts

-

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1,095

$1.249

-

-

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Bristol Electronics

USA . 2,003 parts In-Stock

1+ parts

-

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2,003

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Sensible Micro Corp

USA . 907 parts In-Stock

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907

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 59 parts In-Stock

1+ parts

$0.976

100+ parts

-

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59

$0.976

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-

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Corphita

USA . 435 parts In-Stock

1+ parts

$1.184

100+ parts

-

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435

$1.184

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QUARKTWIN TECHNOLOGY LTD

USA . 13,076 parts In-Stock

1+ parts

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13,076

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Kulean Microsystems

USA . 6,217 parts In-Stock

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6,217

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Microchip USA

USA . 5,072 parts In-Stock

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5,072

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Problanco Electronics

Mexico . 4,463 parts In-Stock

1+ parts

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4,463

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TANS Electronics

Latvia . 1,800 parts In-Stock

1+ parts

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1,800

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UHIMA Technologies

Türkiye . 979 parts In-Stock

1+ parts

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979

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SupplyDigital Components

Austria . 594 parts In-Stock

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594

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Experience top-tier quality and reliability with the N25S830HAT22IT by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge SRAM technology that is perfect for a wide range of applications. With its synchronous operation and separate input/output type, this product offers unparalleled value and performance. Whether you're looking to enhance your industrial equipment or upgrade your consumer electronics, the N25S830HAT22IT provides the speed, efficiency, and versatility you need to stay ahead of the curve. Trust Onsemi to deliver superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise timing and data transmission, making the product suitable for high-performance applications.

Nominal Supply Voltage / Vsup (V): 3

The 3V nominal supply voltage provides efficient power consumption and compatibility with common power sources.

Maximum Clock Frequency (fCLK): 20 MHz

The high maximum clock frequency of 20 MHz allows for fast data processing and improved overall performance.

Memory IC Type: STANDARD SRAM

The use of standard SRAM technology ensures reliable and high-speed memory storage and access for various applications.

Technical Specifications

SRAM N25S830HAT22IT attributes and parameters. Explore more SRAM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

20 MHz

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1, (3 LINE)

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Standby Current:

.000004 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

N25S830HAT22IT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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