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MTD5P06V

Onsemi

MTD5P06V by Onsemi

MTD5P06V by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, 18A IDM, and 0.45 ohm RDS(on). Ideal for SWITCHING applications in ENHANCEMENT MODE operation. Features include SINGLE configuration, GULL WING terminals, and 175°C max temp.

Median Price

$1.600

Lifecycle Status

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14

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 43 parts In-Stock

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$0.380

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$0.290

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American Microsemiconductor Inc.

USA . 370 parts In-Stock

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Digiode

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Vyrian

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Semi Source

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Nova Conductors

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Zilex Electronics Inc.

Canada . 90 parts In-Stock

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DF Sales Co.

USA . 70 parts In-Stock

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DF Sales Co.

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Electronic Expediters

USA . 60 parts In-Stock

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Sunrise Surplus Inc.

USA . 57 parts In-Stock

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A&K Electronics

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Bristol Electronics

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Corohmni

South Africa . 41 parts In-Stock

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$0.727

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Aztec Data Supply Inc.

USA . 33,760 parts In-Stock

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$1.887

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AZTECH Wire

Italy . 632 parts In-Stock

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Ampacity Inc.

Singapore . 1,604 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 7,881 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,940 parts In-Stock

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Argo Parts USA

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Problanco Electronics

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Continental Prestige Electronics

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Corphita

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Aranea Global

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Kulean Microsystems

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SupplyDigital Components

Austria . 974 parts In-Stock

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UHIMA Technologies

Türkiye . 226 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Discover the power and reliability of the MTD5P06V by Onsemi. This P-channel Power Field Effect Transistor (FET) offers top-notch performance for switching applications, with a minimum DS breakdown voltage of 60V and a maximum drain current of 5A. With a compact rectangular package shape and a built-in diode, this transistor is perfect for enhancing your electronic projects. Trust in Onsemi's expertise and quality to deliver exceptional value and benefits to your designs. Take your projects to the next level with the MTD5P06V.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and rugged applications.

Polarity or Channel Type: P-CHANNEL

Being a P-channel FET, this product allows for low power consumption and efficient switching operations.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage, enhancing overall system reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and precise control over power flow.

Surface Mount: YES

With surface mount capabilities, this product can be easily integrated into compact PCB layouts, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures safe operation in various voltage conditions, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and facilitates easy placement on the PCB.

Terminal Form: GULL WING

The gull-wing terminals provide secure connections and efficient heat dissipation, ensuring stable performance under high loads.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control over power flow, making it ideal for applications requiring adjustable output levels.

Maximum Pulsed Drain Current (IDM): 18 A

With a high pulsed drain current rating, this FET can handle short bursts of high current, suitable for applications with peak power demands.

Technical Specifications

Power Field Effect Transistors (FET) MTD5P06V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

125 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTD5P06V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-01-470-7697, 5961014707697

NIIN

014707697

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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