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MTD5P06V-1

Onsemi

MTD5P06V-1 by Onsemi

MTD5P06V-1 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, 18A IDM, and 0.45 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 40W.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,693 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Vyrian

USA . 344 parts In-Stock

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344

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Aztec Data Supply Inc.

USA . 4,700 parts In-Stock

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$1.421

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Corohmni

South Africa . 366 parts In-Stock

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$1.849

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AZTECH Wire

Italy . 756 parts In-Stock

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$9.138

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Ampacity Inc.

Singapore . 1,659 parts In-Stock

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$20.050

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Argo Parts USA

USA . 9,290 parts In-Stock

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Continental Prestige Electronics

USA . 8,254 parts In-Stock

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Problanco Electronics

Mexico . 8,006 parts In-Stock

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Kulean Microsystems

USA . 7,364 parts In-Stock

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SupplyDigital Components

Austria . 6,192 parts In-Stock

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Aranea Global

USA . 3,000 parts In-Stock

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Corphita

USA . 2,423 parts In-Stock

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TANS Electronics

Latvia . 817 parts In-Stock

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UHIMA Technologies

Türkiye . 733 parts In-Stock

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Overview

Upgrade your power systems with the MTD5P06V-1 from Onsemi, a top-of-the-line Power Field Effect Transistor designed for switching applications. With a solid reputation for quality and reliability, Onsemi delivers cutting-edge technology in a compact, efficient package. This P-Channel FET offers customers enhanced performance and durability, making it an ideal choice for a wide range of power management needs. Trust Onsemi to provide the innovation and value you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product

Polarity or Channel Type: P-CHANNEL

Allows for efficient switching operations and low power consumption

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package

Transistor Application: SWITCHING

Ideal for applications that require fast switching speeds and efficient power management

Minimum DS Breakdown Voltage: 60 V

Suitable for use in circuits with higher voltage requirements while maintaining reliability

Maximum Pulsed Drain Current (IDM): 18 A

Capable of handling high peak currents for short durations, making it suitable for applications with intermittent high power requirements

Avalanche Energy Rating (EAS): 125 mJ

Provides protection against avalanche breakdown, ensuring reliability in harsh operating conditions

Maximum Power Dissipation (Abs): 40 W

Can dissipate heat effectively, allowing for continuous operation at high power levels

Maximum Operating Temperature: 175 °C

Can withstand high temperatures, suitable for applications that require reliable performance in challenging environments

Technical Specifications

Power Field Effect Transistors (FET) MTD5P06V-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

125 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTD5P06V-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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