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MMDF2P02ER2

Onsemi

MMDF2P02ER2 by Onsemi

MMDF2P02ER2 by Onsemi is a P-CHANNEL FET with 25V DS Breakdown Voltage, 13A IDM, and 0.25 ohm RDS(on). Ideal for SWITCHING applications, it features a RECTANGULAR package with GULL WING terminals. Operating in ENHANCEMENT MODE, this FET has an EAS of 245mJ and can handle up to 150 °C temperature.

Median Price

$0.781

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,104 parts In-Stock

1+ parts

-

100+ parts

$0.753

1k+ parts

$0.625

10k+ parts

$0.557

4,104

-

$0.753

$0.625

$0.557

DigiKey

USA . 4,104 parts In-Stock

1+ parts

-

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$0.940

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4,104

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$0.940

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Verical

USA . 4,104 parts In-Stock

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$0.781

10k+ parts

$0.697

4,104

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$0.781

$0.697

Distributors (In-Stock)

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Vyrian

USA . 2,046 parts In-Stock

1+ parts

$0.496

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2,046

$0.496

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Digiode

USA . 2,023 parts In-Stock

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$0.587

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$0.587

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Chip Stock

USA . 52,000 parts In-Stock

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52,000

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Classic Components Corporation

USA . 6,778 parts In-Stock

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DigiKey Marketplace

USA . 4,104 parts In-Stock

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Semi Source

USA . 2,500 parts In-Stock

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2,500

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Corel Iberica Componentes, S.L.

Spain . 2,500 parts In-Stock

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2,500

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EMSNET

USA . 1,110 parts In-Stock

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North Shore Components

USA . 1,029 parts In-Stock

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ECAB

Sweden . 1,000 parts In-Stock

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Prism Electronics

USA . 580 parts In-Stock

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Electronics Depot

USA . 446 parts In-Stock

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446

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Distributors (Availability)

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Corohmni

South Africa . 56 parts In-Stock

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$0.496

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56

$0.496

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Corphita

USA . 2,333 parts In-Stock

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$0.556

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$0.556

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Microchip USA

USA . 2,272 parts In-Stock

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$3.835

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$3.835

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Perfect Parts

USA . 10,304 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 9,200 parts In-Stock

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Assy Fe

Spain . 7,500 parts In-Stock

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TANS Electronics

Latvia . 7,116 parts In-Stock

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Kulean Microsystems

USA . 6,540 parts In-Stock

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SupplyDigital Components

Austria . 5,641 parts In-Stock

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Continental Prestige Electronics

USA . 4,104 parts In-Stock

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$0.496

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Problanco Electronics

Mexico . 2,621 parts In-Stock

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Kepictronics

USA . 978 parts In-Stock

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UHIMA Technologies

Türkiye . 504 parts In-Stock

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504

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Overview

Experience superior performance and reliability with the MMDF2P02ER2 by Onsemi. As a leading manufacturer in power field effect transistors, Onsemi delivers top-notch quality and innovation in every product. This P-channel transistor is perfect for various switching applications, offering enhanced efficiency and power management. With a compact package design and high durability, this transistor ensures seamless operation and long-term functionality. Trust Onsemi to provide you with the best-in-class components for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high current-carrying capability, making them suitable for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for more flexibility in designing circuits and the built-in diode helps with reverse current protection.

Transistor Application: SWITCHING

Designed specifically for fast switching applications, ensuring efficient performance.

Surface Mount: YES

Enables easy installation on circuit boards, saving space and making assembly more efficient.

No. of Elements: 2

Having two elements allows for greater control and versatility in circuit design.

Maximum Pulsed Drain Current (IDM): 13 A

High pulsed drain current rating allows for handling sudden spikes in power demand.

Maximum Power Dissipation (Abs): 2 W

Efficient power dissipation ensures the FET operates within safe temperature limits.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, suitable for a variety of environments.

Technical Specifications

Power Field Effect Transistors (FET) MMDF2P02ER2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

245 mJ

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

13 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMDF2P02ER2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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