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MMBF5457LT1G

Onsemi

MMBF5457LT1G by Onsemi

MMBF5457LT1G by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, ideal for AMPLIFIER applications. It features DEPLETION MODE operation, GULL WING terminals, and 3pF Crss. With a max power dissipation of 0.225W and operating temperature up to 150°C, it is suitable for small outline packages in electronic circuits.

Median Price

$0.582

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 40 parts In-Stock

1+ parts

$0.582

100+ parts

$0.530

1k+ parts

$0.477

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40

$0.582

$0.530

$0.477

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Distributors (In-Stock)

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Nova Conductors

Japan . 67 parts In-Stock

1+ parts

$0.146

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67

$0.146

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Digiode

USA . 666 parts In-Stock

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$0.553

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666

$0.553

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Chip Stock

USA . 14,990 parts In-Stock

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14,990

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Vyrian

USA . 9,201 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 394 parts In-Stock

1+ parts

$0.143

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394

$0.143

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Continental Prestige Electronics

USA . 4,270 parts In-Stock

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$0.146

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$0.143

4,270

$0.146

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-

$0.143

Argo Parts USA

USA . 1,684 parts In-Stock

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$0.146

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$0.142

1,684

$0.146

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$0.142

Ampacity Inc.

Singapore . 40 parts In-Stock

1+ parts

$0.495

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40

$0.495

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Semicontronic

India . 40 parts In-Stock

1+ parts

$0.495

100+ parts

$0.483

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$0.480

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40

$0.495

$0.483

$0.480

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Corphita

USA . 1,406 parts In-Stock

1+ parts

$0.524

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1,406

$0.524

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$0.582

100+ parts

$0.530

1k+ parts

$0.477

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40

$0.582

$0.530

$0.477

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Aztec Data Supply Inc.

USA . 4,150 parts In-Stock

1+ parts

$1.028

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$1.028

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AZTECH Wire

Italy . 884 parts In-Stock

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$17.681

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884

$17.681

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Component Stockers USA

USA . 333 parts In-Stock

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$99.990

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333

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Kepictronics

USA . 24,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,997 parts In-Stock

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Kulean Microsystems

USA . 6,790 parts In-Stock

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Lixinc

USA . 6,189 parts In-Stock

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SupplyDigital Components

Austria . 3,720 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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TANS Electronics

Latvia . 1,710 parts In-Stock

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Metaverse IC Inc.

Canada . 1,395 parts In-Stock

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Problanco Electronics

Mexico . 1,327 parts In-Stock

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UHIMA Technologies

Türkiye . 550 parts In-Stock

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550

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Overview

Enhance your electronic designs with the MMBF5457LT1G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This small signal field-effect transistor offers superior performance in amplifier applications, making it a versatile solution for various projects. With its N-channel configuration and depletion mode operation, this transistor provides excellent amplification capabilities. Say goodbye to compromises and experience the value and benefits of using the MMBF5457LT1G in your next project. Trust Onsemi to deliver unmatched quality and innovation every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the transistor lightweight and durable, ideal for applications where weight and size are a concern.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer higher mobility of charge carriers, leading to better performance and efficiency in amplifier applications.

Configuration: SINGLE

Single configuration simplifies circuit design and implementation, making it easier to incorporate into existing amplifier setups.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance and reliability when used in amplification circuits.

Surface Mount: YES

Surface mount capability allows for easy installation and saves valuable space on the PCB, making it suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle higher voltage levels, providing reliability and protection against voltage surges.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient placement on the PCB and aids in heat dissipation, maintaining stable performance.

Terminal Form: GULL WING

Gull wing terminal form provides reliable connections and ease of soldering during assembly, enhancing the overall durability of the transistor.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for greater control over the amplifier circuit, offering flexibility in adjusting the transistor's characteristics.

No. of Terminals: 3

Having 3 terminals simplifies the connectivity and integration of the transistor into amplifier circuits, reducing complexity and potential errors.

Maximum Power Dissipation (Abs): 0.225 W

With a maximum power dissipation of 0.225W, this transistor can handle moderate power levels, ensuring reliable performance in amplifier applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact electronic devices where size is a constraint.

Field Effect Transistor Technology: JUNCTION

Junction technology offers higher switching speeds and lower noise levels, making it suitable for amplifier applications where performance is crucial.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high temperatures, ensuring stability and reliability in various operating conditions.

Transistor Element Material: SILICON

Silicon material provides high performance and reliability, making the transistor suitable for demanding amplifier applications where quality is essential.

Terminal Finish: TIN

Tin terminal finish offers excellent solderability and corrosion resistance, ensuring robust connections and long-term reliability in amplifier circuits.

Terminal Position: DUAL

Dual terminal position enables easy and secure mounting on the PCB, providing stable connections and simplifying the assembly process.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient soldering during assembly, saving time and ensuring proper connections for reliable performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can withstand high-temperature soldering processes, ensuring durable and stable connections.

Maximum Feedback Capacitance (Crss): 3 pF

Low feedback capacitance of 3pF minimizes signal loss and distortion, improving the overall performance and signal integrity of the amplifier circuit.

Technical Specifications

Small Signal Field Effect Transistors (FET) MMBF5457LT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

3 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MMBF5457LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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