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MJD128T4

Onsemi

MJD128T4 by Onsemi

MJD128T4 by Onsemi is a PNP Darlington transistor with 120V max collector-emitter voltage, 8A max collector current, and 20W max power dissipation. Ideal for switching applications in small outline packages with Gull Wing terminals.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,692 parts In-Stock

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Digiode

USA . 1,009 parts In-Stock

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AZTECH Wire

Italy . 382 parts In-Stock

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$14.040

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382

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Kepictronics

USA . 56,000 parts In-Stock

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SupplyDigital Components

Austria . 5,324 parts In-Stock

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Problanco Electronics

Mexico . 4,532 parts In-Stock

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Kulean Microsystems

USA . 3,437 parts In-Stock

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TANS Electronics

Latvia . 1,514 parts In-Stock

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Corphita

USA . 859 parts In-Stock

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UHIMA Technologies

Türkiye . 258 parts In-Stock

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Corohmni

South Africa . 85 parts In-Stock

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Overview

Enhance the power of your electronic devices with the MJD128T4 by Onsemi, a high-quality Power BJT transistor designed for switching applications. Manufactured by industry leader Onsemi, this PNP Darlington transistor offers reliable performance and durability in a compact, surface-mount package. With a maximum collector-emitter voltage of 120V and a maximum collector current of 8A, the MJD128T4 ensures efficient power management in a wide range of applications. Trust Onsemi for superior quality and performance in every electronic component you use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and durability, making the transistor reliable for long-term use.

Polarity or Channel Type: PNP

Allows for efficient current flow in the PNP configuration, suitable for various types of switching applications.

Configuration: DARLINGTON

Darlington configuration provides high current gain and allows for high-power switching applications, making it a versatile choice.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Enables easy and efficient mounting on a printed circuit board, saving space and reducing assembly time.

Maximum Power Dissipation (Abs): 20 W

With a high maximum power dissipation, this transistor can handle heavy load conditions without overheating.

Minimum DC Current Gain (hFE): 100

High minimum DC current gain ensures consistent and stable amplification of input signal.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, suitable for demanding environments.

Maximum Collector-Emitter Voltage: 120 V

Can withstand high collector-emitter voltages, making it suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon-based transistor element material offers good thermal conductivity and reliability.

Maximum Collector Current (IC): 8 A

Capable of handling high collector currents, suitable for applications requiring high power.

Terminal Finish: TIN LEAD

Provides good solderability and conductivity for reliable connection in the circuit.

Case Connection: COLLECTOR

Specific case connection allows for easy integration into the circuit design.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during assembly processes, ensuring proper soldering and connection.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJD128T4 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

120 V

Configuration:

Minimum DC Current Gain (hFE):

100

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MJD128T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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