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MJD112RL

Onsemi

MJD112RL by Onsemi

MJD112RL by Onsemi is a NPN BJT with Darlington configuration, built-in diode and resistor. It has a max power dissipation of 20W, hFE of 200, and operates up to 150 °C. Ideal for switching applications due to its high collector current of 2A and max voltage of 100V.

Median Price

$0.953

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 1,600 parts In-Stock

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$1.540

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$1.150

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$1.000

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1,600

$1.540

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$1.000

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Vyrian

USA . 5,919 parts In-Stock

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A2Z Electronics, Inc.

USA . 5,240 parts In-Stock

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5,240

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Bristol Electronics

USA . 5,240 parts In-Stock

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$0.366

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$0.180

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$0.146

5,240

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$0.366

$0.180

$0.146

M&R Communications

USA . 3,600 parts In-Stock

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3,600

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Digiode

USA . 2,155 parts In-Stock

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Electronic Expediters

USA . 1,800 parts In-Stock

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Connector Distribution Corp

USA . 1,793 parts In-Stock

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1,793

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Right Parts Inc.

USA . 1,793 parts In-Stock

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EMSNET

USA . 1,657 parts In-Stock

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Microfarads

USA . 1,573 parts In-Stock

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Elcom Components

USA . 972 parts In-Stock

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MISTER SPROCKETS

USA . 800 parts In-Stock

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800

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Prism Electronics

USA . 46 parts In-Stock

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Legend Electronics Inc.

USA . 38 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 119 parts In-Stock

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$1.540

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AZTECH Wire

Italy . 189 parts In-Stock

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$14.170

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Perfect Parts

USA . 16,852 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 5,612 parts In-Stock

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SupplyDigital Components

Austria . 4,354 parts In-Stock

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RC Electronics

USA . 3,600 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 2,081 parts In-Stock

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Corphita

USA . 1,871 parts In-Stock

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Problanco Electronics

Mexico . 1,664 parts In-Stock

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UHIMA Technologies

Türkiye . 959 parts In-Stock

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Overview

Elevate your power switch applications with the MJD112RL by Onsemi, a high-quality Power BJT transistor that boasts a Darlington configuration with a built-in diode and resistor. Perfect for switching tasks, this NPN transistor offers a maximum collector-emitter voltage of 100V and a maximum collector current of 2A, ensuring reliable performance. With a small outline package shape and gull wing terminals, this transistor is easy to install and guarantees efficient heat dissipation. Trust Onsemi's reputation for excellence and upgrade your electronic projects with the MJD112RL today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, making this transistor versatile for various applications.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

The Darlington configuration offers high current gain and the built-in diode and resistor add convenience in circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Maximum Power Dissipation (Abs): 20 W

With a high power dissipation capacity, this transistor can handle higher loads without overheating.

Maximum Collector-Emitter Voltage: 100 V

With a high voltage rating, this transistor can be used in circuits that require higher voltages.

Maximum Collector Current (IC): 2 A

The high collector current rating allows this transistor to handle higher current loads, suitable for various applications.

Nominal Transition Frequency (fT): 25 MHz

The high transition frequency allows for fast switching speeds, making this transistor suitable for high-frequency applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJD112RL attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

2 A

Maximum Collector-Emitter Voltage:

100 V

Minimum DC Current Gain (hFE):

200

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJD112RL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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