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MC75174BPG

Onsemi

MC75174BPG by Onsemi

MC75174BPG by Onsemi is a 4-function line driver with 16 terminals. It operates at 5V, has a max transmit delay of 25ns, and supports differential output. Ideal for industrial applications requiring V.11, X.27, EIA-422-A, or EIA-485 interface standards in temperatures ranging from -40 to 85 °C.

Median Price

$1.649

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,459 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.390

10k+ parts

$1.310

1,459

-

$1.560

$1.390

$1.310

Verical

USA . 1,051 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.738

10k+ parts

-

1,051

-

-

$1.738

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 700 parts In-Stock

1+ parts

$1.644

100+ parts

-

1k+ parts

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700

$1.644

-

-

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Vyrian

USA . 5,545 parts In-Stock

1+ parts

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5,545

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,934 parts In-Stock

1+ parts

$1.557

100+ parts

-

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-

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1,934

$1.557

-

-

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Corohmni

South Africa . 365 parts In-Stock

1+ parts

$1.730

100+ parts

-

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365

$1.730

-

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AZTECH Wire

Italy . 948 parts In-Stock

1+ parts

$10.970

100+ parts

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948

$10.970

-

-

-

Problanco Electronics

Mexico . 7,756 parts In-Stock

1+ parts

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7,756

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TANS Electronics

Latvia . 7,467 parts In-Stock

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7,467

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SupplyDigital Components

Austria . 5,329 parts In-Stock

1+ parts

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5,329

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Microchip USA

USA . 5,047 parts In-Stock

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5,047

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Kulean Microsystems

USA . 4,361 parts In-Stock

1+ parts

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4,361

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QUARKTWIN TECHNOLOGY LTD

USA . 3,252 parts In-Stock

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3,252

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Continental Prestige Electronics

USA . 1,709 parts In-Stock

1+ parts

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100+ parts

$1.480

1k+ parts

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10k+ parts

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1,709

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$1.480

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UHIMA Technologies

Türkiye . 813 parts In-Stock

1+ parts

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813

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Overview

Enhance your electronic systems with the MC75174BPG by Onsemi, a top-notch line driver and receiver that delivers reliable performance and seamless connectivity. Manufactured by Onsemi, a renowned leader in the industry, this product offers unmatched quality and durability. Ideal for a wide range of applications, this versatile component ensures smooth data transmission and superior signal integrity. Experience the value and benefits of the MC75174BPG, designed to meet your specific needs and exceed your expectations. Elevate your projects with this cutting-edge technology from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product.

Maximum Supply Voltage: 5.25 V

Supports higher voltages, making it versatile for different applications.

No. of Functions: 4

Multiple functions provide flexibility and functionality in various setups.

Maximum Transmit Delay: 25 ns

Fast transmit delay ensures efficient signal transmission.

Power Supplies (V): 5

Operates at a standard voltage for easy integration into existing systems.

No. of Terminals: 16

Sufficient terminals for connections and compatibility with different setups.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Output Characteristics: 3-STATE

3-state output allows for flexible control over the output signal.

Differential Output: YES

Differential output helps in reducing noise and interference in signal transmission.

Technology: BIPOLAR

Bipolar technology ensures reliable performance and compatibility with various systems.

Technical Specifications

Line Drivers & Receivers MC75174BPG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

V.11; X.27; EIA-422-A; EIA-485

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

4.44 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Transmit Delay:

25 ns

Width:

7.62 mm

Trade Compliance

MC75174BPG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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