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MC75174BDWG

Onsemi

MC75174BDWG by Onsemi

MC75174BDWG by Onsemi is a 4-function line driver with 5V supply, 25ns max transmit delay, and 0ns max receive delay. Ideal for industrial applications requiring V.11, X.27, EIA-422-A, or EIA-485 interface standards in a small outline package.

Median Price

$1.530

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 54 parts In-Stock

1+ parts

$1.530

100+ parts

$1.500

1k+ parts

$1.470

10k+ parts

-

54

$1.530

$1.500

$1.470

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,062 parts In-Stock

1+ parts

$1.454

100+ parts

-

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2,062

$1.454

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Vyrian

USA . 2,920 parts In-Stock

1+ parts

-

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2,920

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,433 parts In-Stock

1+ parts

$1.377

100+ parts

-

1k+ parts

-

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2,433

$1.377

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-

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Corohmni

South Africa . 440 parts In-Stock

1+ parts

$1.530

100+ parts

-

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440

$1.530

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AZTECH Wire

Italy . 76 parts In-Stock

1+ parts

$13.300

100+ parts

-

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76

$13.300

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Component Stockers USA

USA . 509 parts In-Stock

1+ parts

$99.990

100+ parts

-

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509

$99.990

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 27,659 parts In-Stock

1+ parts

-

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27,659

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Kulean Microsystems

USA . 7,073 parts In-Stock

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7,073

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A-Z Elektronik GmbH

Germany . 6,945 parts In-Stock

1+ parts

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6,945

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TANS Electronics

Latvia . 2,029 parts In-Stock

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2,029

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Problanco Electronics

Mexico . 1,937 parts In-Stock

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1,937

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Metaverse IC Inc.

Canada . 420 parts In-Stock

1+ parts

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420

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Microchip USA

USA . 152 parts In-Stock

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152

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SupplyDigital Components

Austria . 126 parts In-Stock

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126

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UHIMA Technologies

Türkiye . 52 parts In-Stock

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52

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Overview

Enhance your electronic designs with the MC75174BDWG Line Driver & Receiver by Onsemi. Known for their high-quality products, Onsemi delivers reliability and precision in every component. Ideal for a wide range of applications, this versatile device offers exceptional value to customers looking for efficient signal transmission and reception. With its compact design and advanced technology, the MC75174BDWG provides seamless connectivity and enhanced performance, making it an essential choice for your next project. Experience the benefits of Onsemi's expertise and elevate your designs with the MC75174BDWG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components, making the product suitable for various environments.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power input, accommodating a wide range of applications.

No. of Functions: 4

With 4 functions in one device, it offers convenience and efficiency in managing multiple signal processing tasks.

Maximum Transmit Delay: 25 ns

The low transmit delay ensures fast and reliable signal transmission, critical for reducing latency in communication systems.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate control, enabling the driver to be in an active, high impedance, or disabled state as needed.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh environmental conditions and operate reliably in demanding settings.

Interface Standard: V.11; X.27; EIA-422-A; EIA-485

Compliance with multiple interface standards ensures compatibility with a range of communication protocols, increasing the product's versatility.

Technical Specifications

Line Drivers & Receivers MC75174BDWG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

V.11; X.27; EIA-422-A; EIA-485

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Transmit Delay:

25 ns

Width:

7.5 mm

Trade Compliance

MC75174BDWG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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