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MC75172BP

Onsemi

MC75172BP by Onsemi

MC75172BP by Onsemi is a 16-terminal line driver with 25ns max transmit delay, operating at -40 to 85 °C. It features 3-STATE output, differential output, and requires 5V supply voltage. Ideal for industrial applications requiring fast signal transmission in a compact rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 830 parts In-Stock

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Vyrian

USA . 499 parts In-Stock

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TANS Electronics

Latvia . 7,613 parts In-Stock

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Problanco Electronics

Mexico . 7,292 parts In-Stock

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SupplyDigital Components

Austria . 3,138 parts In-Stock

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Kulean Microsystems

USA . 2,915 parts In-Stock

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Corohmni

South Africa . 447 parts In-Stock

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UHIMA Technologies

Türkiye . 351 parts In-Stock

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Corphita

USA . 55 parts In-Stock

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Overview

Enhance your electronic designs with the MC75172BP line driver & receiver by Onsemi. With a reputation for high-quality products, Onsemi delivers reliable components for a variety of applications. This versatile device offers customers value and benefits such as fast transmit delay, industrial temperature grade, and differential output capability. Trust Onsemi to provide cutting-edge technology that meets your needs in the most demanding environments. Elevate your projects with the MC75172BP – the perfect solution for your next design challenge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Transmit Delay: 25 ns

With a low transmit delay, this product offers fast signal transmission and efficient performance.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of systems and applications.

No. of Terminals: 16

Having a higher number of terminals allows for more connectivity options and flexibility in system integration.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environments and extended use.

Technology: BIPOLAR

Bipolar technology ensures reliable performance and accurate signal processing, making this product a dependable choice.

Technical Specifications

Line Drivers & Receivers MC75172BP attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

25 ns

Trade Compliance

MC75172BP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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