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MC75174BDWR2G

Onsemi

MC75174BDWR2G by Onsemi

MC75174BDWR2G by Onsemi is a 4-function line driver with 3-STATE output. It operates at -40 to 85 °C, with max supply voltage of 5.25 V and min swing of 1.5 V. Ideal for industrial applications requiring differential outputs in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,954 parts In-Stock

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Digiode

USA . 2,346 parts In-Stock

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AZTECH Wire

Italy . 161 parts In-Stock

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$14.040

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TANS Electronics

Latvia . 8,074 parts In-Stock

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Problanco Electronics

Mexico . 7,128 parts In-Stock

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Kulean Microsystems

USA . 5,109 parts In-Stock

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

Austria . 1,945 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 931 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 143 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic systems with the MC75174BDWR2G by Onsemi, a top-quality Line Driver & Receiver that guarantees high performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers exceptional value with its advanced technology and innovative design. Ideal for a wide range of applications, this Line Driver & Receiver is the perfect solution for your communication needs. Experience seamless connectivity and superior functionality with the MC75174BDWR2G by Onsemi. Upgrade your systems today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Easy to install and saves space on the circuit board, making it ideal for compact designs.

Maximum Supply Voltage: 5.25 V

Can safely handle higher voltage inputs, offering flexibility in various applications.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components, simplifying the overall circuit design.

Maximum Transmit Delay: 25 ns

Provides fast signal transmission, improving overall system performance.

Power Supplies (V): 5

Compatible with standard power supplies, ensuring easy integration into existing systems.

No. of Terminals: 20

Sufficient terminals for connecting to other components, allowing for versatile connectivity options.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in controlling the signal flow, allowing for more versatile operation.

Technology: BIPOLAR

Bipolar technology offers high speed and precision in signal processing, ensuring reliable performance.

Technical Specifications

Line Drivers & Receivers MC75174BDWR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

V.11; X.27; EIA-422-A; EIA-485

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Transmit Delay:

25 ns

Width:

7.5 mm

Trade Compliance

MC75174BDWR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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