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MC75172BDWR2

Onsemi

MC75172BDWR2 by Onsemi

MC75172BDWR2 by Onsemi is a 4-function line driver with 5V supply, 25ns max transmit delay, and -40 to 85 °C operating temp. Ideal for industrial applications requiring V.11, X.27, EIA-422-A, or EIA-485 interface standards in a small outline package.

Median Price

$2.110

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 1,074 parts In-Stock

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$2.110

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Digiode

USA . 1,413 parts In-Stock

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Vyrian

USA . 1,368 parts In-Stock

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PC Components Company LLC

USA . 950 parts In-Stock

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950

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Bristol Electronics

USA . 950 parts In-Stock

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950

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Inland Empire Components Inc.

USA . 400 parts In-Stock

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400

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ACDS - Activité Composants Distribution Service

France . 325 parts In-Stock

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Dan-Mar Components

USA . 325 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 481 parts In-Stock

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$2.110

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Component Stockers USA

USA . 754 parts In-Stock

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$99.990

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754

$99.990

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Assy Fe

Spain . 44,000 parts In-Stock

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Kulean Microsystems

USA . 5,341 parts In-Stock

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TANS Electronics

Latvia . 4,069 parts In-Stock

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SupplyDigital Components

Austria . 2,943 parts In-Stock

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Problanco Electronics

Mexico . 2,531 parts In-Stock

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Corphita

USA . 2,011 parts In-Stock

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UHIMA Technologies

Türkiye . 201 parts In-Stock

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Microchip USA

USA . 144 parts In-Stock

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Overview

Enhance your electronic projects with the MC75172BDWR2 by Onsemi, a top-quality line driver and receiver designed to deliver exceptional performance. Manufactured by Onsemi, a trusted leader in semiconductor solutions, this product offers unmatched reliability and precision. Ideal for a wide range of applications, this line driver ensures seamless data transmission, making it perfect for industrial and commercial use. Experience the value of superior technology with the MC75172BDWR2, providing customers with unparalleled benefits and advantages. Elevate your projects with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making this product a reliable choice for various applications.

Surface Mount - YES

The surface mount capability allows for easy and efficient installation, making this product suitable for compact and space-constrained designs.

Maximum Supply Voltage - 5.25 V

The high maximum supply voltage allows for versatile compatibility with different systems and power sources.

No. of Functions - 4

With multiple functions integrated into one device, this product offers cost-effectiveness and efficiency in circuit design.

Maximum Transmit Delay - 25 ns

The low transmit delay ensures fast and accurate data transmission, making this product suitable for high-speed applications.

Power Supplies (V) - 5

The standard power supply voltage of 5V simplifies integration with existing systems and reduces the need for additional power conversion components.

No. of Terminals - 20

The high number of terminals allows for versatile connectivity options, making this product suitable for complex circuit requirements.

Maximum Operating Temperature - 85 °C

The wide operating temperature range of up to 85 °C makes this product suitable for use in harsh environmental conditions and industrial applications.

Technical Specifications

Line Drivers & Receivers MC75172BDWR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

V.11; X.27; EIA-422-A; EIA-485

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

25 ns

Width:

7.5 mm

Trade Compliance

MC75172BDWR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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