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MC75174BDWR2

Onsemi

MC75174BDWR2 by Onsemi

MC75174BDWR2 by Onsemi is a 4-function line driver with 5V supply, 25ns max transmit delay, and 0ns max receive delay. Ideal for industrial applications requiring EIA-422-A/EIA-485 interface standards in compact SMD package.

Median Price

$2.310

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 207 parts In-Stock

1+ parts

$2.310

100+ parts

$1.730

1k+ parts

$1.500

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207

$2.310

$1.730

$1.500

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Digiode

USA . 1,506 parts In-Stock

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NexGen Digital

USA . 715 parts In-Stock

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Bristol Electronics

USA . 466 parts In-Stock

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466

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Vyrian

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Resion

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Distributors (Availability)

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Corohmni

South Africa . 352 parts In-Stock

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$2.310

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SupplyDigital Components

Austria . 8,312 parts In-Stock

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Kulean Microsystems

USA . 6,380 parts In-Stock

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Infinite Electronics LLP (Excess)

. 4,346 parts In-Stock

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TANS Electronics

Latvia . 3,506 parts In-Stock

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Problanco Electronics

Mexico . 2,666 parts In-Stock

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Corphita

USA . 2,476 parts In-Stock

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UHIMA Technologies

Türkiye . 648 parts In-Stock

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Microchip USA

USA . 360 parts In-Stock

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Perfect Parts

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Overview

Discover the high-quality MC75174BDWR2 by Onsemi, a top-of-the-line Line Driver & Receiver that promises superior performance and reliability. With a reputation for excellence, Onsemi delivers cutting-edge technology that sets industry standards. This versatile product is perfect for a wide range of applications, offering customers seamless integration, enhanced efficiency, and unparalleled value. Trust Onsemi to provide you with the best solution for your needs, ensuring optimal results every time. Elevate your projects with the MC75174BDWR2 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of systems and provides ample power for reliable operation.

Maximum Transmit Delay: 25 ns

The low transmit delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Output Characteristics: 3-STATE

The 3-STATE output feature allows for effective control of the output signal, enhancing the versatility and functionality of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions, making the product ideal for industrial applications.

Technical Specifications

Line Drivers & Receivers MC75174BDWR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

V.11; X.27; EIA-422-A; EIA-485

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

25 ns

Width:

7.5 mm

Trade Compliance

MC75174BDWR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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