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MC74VHCT574ADWRG

Onsemi

MC74VHCT574ADWRG by Onsemi

MC74VHCT574ADWRG by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a max frequency of 95MHz. It has a propagation delay of 11.5ns and can handle a load capacitance of 50pF. Ideal for industrial applications requiring positive edge triggering in a compact small outline package.

Median Price

$1.734

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 494 parts In-Stock

1+ parts

$1.740

100+ parts

$0.816

1k+ parts

$0.516

10k+ parts

$0.475

494

$1.740

$0.816

$0.516

$0.475

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.734

10k+ parts

$1.653

1,000

-

-

$1.734

$1.653

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

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$1.734

10k+ parts

$1.653

1,000

-

-

$1.734

$1.653

Rochester

USA . 447 parts In-Stock

1+ parts

-

100+ parts

$0.596

1k+ parts

$0.494

10k+ parts

$0.441

447

-

$0.596

$0.494

$0.441

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,104 parts In-Stock

1+ parts

$0.463

100+ parts

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2,104

$0.463

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Flip Electronics

USA . 10,000 parts In-Stock

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Vyrian

USA . 5,717 parts In-Stock

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5,717

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Distributors (Availability)

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Corphita

USA . 477 parts In-Stock

1+ parts

$0.438

100+ parts

-

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477

$0.438

-

-

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Corohmni

South Africa . 354 parts In-Stock

1+ parts

$0.487

100+ parts

-

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354

$0.487

-

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QUARKTWIN TECHNOLOGY LTD

USA . 24,621 parts In-Stock

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24,621

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SupplyDigital Components

Austria . 6,238 parts In-Stock

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6,238

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Component Stockers USA

USA . 5,904 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.480

10k+ parts

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5,904

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$0.480

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Kulean Microsystems

USA . 5,274 parts In-Stock

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5,274

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Problanco Electronics

Mexico . 2,962 parts In-Stock

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2,962

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TANS Electronics

Latvia . 2,467 parts In-Stock

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2,467

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UHIMA Technologies

Türkiye . 441 parts In-Stock

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441

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Overview

Unlock the power of efficient signal transmission with the MC74VHCT574ADWRG by Onsemi. Crafted with precision and expertise, this bus driver & transceiver is designed to deliver top-notch performance in a variety of applications. With a focus on quality and reliability, Onsemi has created a product that not only meets but exceeds industry standards. Experience seamless communication and enhanced functionality with the MC74VHCT574ADWRG, offering customers unparalleled value and benefits. Trust in Onsemi for cutting-edge technology that drives innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the product, making it suitable for various environments and conditions.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with many systems and simplifies power requirements.

Maximum I (ol): 8 Amp

The high maximum output current rating of 8 Amp allows for efficient power delivery in the circuit.

Propagation Delay (tpd): 11.5 ns

Low propagation delay ensures fast signal transmission and response times, contributing to the overall performance of the product.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this product can operate effectively in harsh and extreme conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing its efficiency and reliability.

Technical Specifications

Bus Driver & Transceivers MC74VHCT574ADWRG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

95000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

MC74VHCT574ADWRG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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