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MC74VHCT244ADTG

Onsemi

MC74VHCT244ADTG by Onsemi

MC74VHCT244ADTG by Onsemi is a 20-terminal bus driver with 10.5ns propagation delay and 9.5ns tpd, suitable for industrial applications. It operates at a nominal voltage of 5V, has a load capacitance of 50pF, and features TRUE output polarity. The device is surface mountable and offers dual terminal position with GULL WING form factor.

Median Price

$0.890

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 141 parts In-Stock

1+ parts

$0.890

100+ parts

$0.492

1k+ parts

$0.435

10k+ parts

$0.384

141

$0.890

$0.492

$0.435

$0.384

Distributors (In-Stock)

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Digiode

USA . 94 parts In-Stock

1+ parts

$0.988

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-

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94

$0.988

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TME

Poland . 219 parts In-Stock

1+ parts

$1.380

100+ parts

$0.526

1k+ parts

$0.504

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-

219

$1.380

$0.526

$0.504

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Flip Electronics

USA . 8,025 parts In-Stock

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8,025

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Vyrian

USA . 7,454 parts In-Stock

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Bristol Electronics

USA . 155 parts In-Stock

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155

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Distributors (Availability)

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Corphita

USA . 1,014 parts In-Stock

1+ parts

$0.936

100+ parts

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1,014

$0.936

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Corohmni

South Africa . 333 parts In-Stock

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$1.040

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333

$1.040

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SupplyDigital Components

Austria . 7,787 parts In-Stock

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7,787

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Kulean Microsystems

USA . 6,816 parts In-Stock

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Problanco Electronics

Mexico . 6,153 parts In-Stock

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Perfect Parts

USA . 5,365 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,968 parts In-Stock

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TANS Electronics

Latvia . 2,743 parts In-Stock

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2,743

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UHIMA Technologies

Türkiye . 552 parts In-Stock

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552

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ChipTracer

USA . 155 parts In-Stock

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155

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SIE Connect GmbH (Excess)

Germany . 100 parts In-Stock

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100

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Overview

Experience seamless data transmission and reliable performance with the MC74VHCT244ADTG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and cutting-edge technology in their bus driver & transceivers category. Perfect for a variety of applications, this product offers fast propagation delay, low power consumption, and a compact design. With its 3-state output characteristics and true output polarity, customers can trust in the value, efficiency, and versatility that the MC74VHCT244ADTG brings to their projects. Elevate your electronics with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount feature allows for easy installation and space-saving on PCBs.

Package Shape: RECTANGULAR

Rectangular package shape offers compatibility with standard PCB layouts and easy placement.

No. of Bits: 4

Having 4 bits allows for a wide range of data processing and communication capabilities in the product.

Nominal Supply Voltage / Vsup (V): 5

Suitable nominal supply voltage of 5V ensures compatibility with many standard systems and power sources.

Load Capacitance (CL): 50 pF

Low load capacitance helps in minimizing power consumption and improving overall efficiency.

Output Characteristics: 3-STATE

3-state output provides additional flexibility and functionality in managing signal outputs.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting and efficient use of PCB space.

Technical Specifications

Bus Driver & Transceivers MC74VHCT244ADTG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MC74VHCT244ADTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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