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MC74VHCT126ADR2

Onsemi

MC74VHCT126ADR2 by Onsemi

MC74VHCT126ADR2 by Onsemi is a 4-function bus driver with 8.5ns propagation delay at 5V, suitable for industrial applications. It features 3-STATE output, operates b/w -40 to 85 °C, and has a max seated height of 1.75mm.

Median Price

$0.119

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 29,791 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

29,791

-

$0.119

$0.099

$0.088

DigiKey

USA . 29,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.150

29,791

-

-

-

$0.150

Verical

USA . 29,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.110

29,791

-

-

-

$0.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,701 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

-

10k+ parts

-

1,701

$0.093

-

-

-

DigiKey Marketplace

USA . 49,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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49,791

-

-

-

-

Vyrian

USA . 7,985 parts In-Stock

1+ parts

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7,985

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 191 parts In-Stock

1+ parts

$0.088

100+ parts

-

1k+ parts

-

10k+ parts

-

191

$0.088

-

-

-

Corohmni

South Africa . 304 parts In-Stock

1+ parts

$0.098

100+ parts

-

1k+ parts

-

10k+ parts

-

304

$0.098

-

-

-

AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$17.560

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$17.560

-

-

-

Continental Prestige Electronics

USA . 49,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.085

10k+ parts

-

49,791

-

-

$0.085

-

Problanco Electronics

Mexico . 4,322 parts In-Stock

1+ parts

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100+ parts

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4,322

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SupplyDigital Components

Austria . 4,239 parts In-Stock

1+ parts

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4,239

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TANS Electronics

Latvia . 3,229 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,229

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Kulean Microsystems

USA . 1,165 parts In-Stock

1+ parts

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1,165

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Microchip USA

USA . 401 parts In-Stock

1+ parts

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401

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UHIMA Technologies

Türkiye . 112 parts In-Stock

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112

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Overview

Enhance your electronic projects with the MC74VHCT126ADR2 from Onsemi, a leading manufacturer in the industry. This high-quality Bus Driver & Transceiver offers reliable performance and seamless integration. With 4 functions, a small outline package style, and a wide temperature range, this versatile component is perfect for a variety of applications. From industrial automation to consumer electronics, experience the value and benefits of the MC74VHCT126ADR2 in your designs. Upgrade your projects today with Onsemi's premium quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast signal transmission within the system.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on PCBs.

No. of Functions: 4

Multiple functions in a single component provide efficiency and cost-effectiveness.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage makes integration into existing systems easier.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable signal transmission.

Power Supplies (V): 5

Consistent power supply for reliable performance.

No. of Terminals: 14

Sufficient terminals for connectivity to other components.

Package Style (Meter): SMALL OUTLINE

Compact size for efficient use of PCB space.

Maximum I (ol): 8 Amp

High output current capability for driving loads.

Propagation Delay (tpd): 13 ns

Low propagation delay ensures fast signal transmission within the system.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state for bus sharing applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range suitable for various environments.

Terminal Finish: TIN LEAD

Tin lead finish for good solderability and conductivity.

Terminal Position: DUAL

Dual terminal position for easy installation and connectivity.

No. of Ports: 2

Multiple ports for connection to different parts of the system.

Maximum Seated Height: 1.75 mm

Low profile for compact PCB designs.

Width: 3.9 mm

Small width for efficient use of PCB space.

Output Polarity: TRUE

True output polarity for accurate signal transmission.

Minimum Supply Voltage (Vsup): 4.5 V

Wide supply voltage range for flexibility in system design.

Peak Reflow Temperature °C: 235

High-temperature tolerance during reflow soldering process.

Length: 8.65 mm

Compact length for efficient use of PCB space.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and mechanical strength.

Packing Method: TR

Tape and reel packing for easy handling and automated assembly.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with existing systems.

Control Type: ENABLE HIGH

Controlled enable high feature for flexible operation.

Maximum Supply Voltage (Vsup): 5.5 V

High supply voltage tolerance for reliability.

Technical Specifications

Bus Driver & Transceivers MC74VHCT126ADR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Control Type:

ENABLE HIGH

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74VHCT126ADR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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