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MC74VHCT125ADTR2G

Onsemi

MC74VHCT125ADTR2G by Onsemi

MC74VHCT125ADTR2G by Onsemi is a 4-function bus driver with 10.5ns propagation delay at 5V, suitable for military-grade applications. It features a max I (ol) of 8A, TRUE output polarity, and operates b/w -55 to 125 °C. Ideal for surface mount designs with a small outline package style.

Median Price

$0.460

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,559 parts In-Stock

1+ parts

$0.460

100+ parts

$0.246

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$0.207

10k+ parts

$0.183

1,559

$0.460

$0.246

$0.207

$0.183

Distributors (In-Stock)

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Vyrian

USA . 3,198 parts In-Stock

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Digiode

USA . 305 parts In-Stock

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AZTECH Wire

Italy . 609 parts In-Stock

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$9.810

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609

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TANS Electronics

Latvia . 8,357 parts In-Stock

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Kulean Microsystems

USA . 6,935 parts In-Stock

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SupplyDigital Components

Austria . 6,841 parts In-Stock

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Problanco Electronics

Mexico . 4,667 parts In-Stock

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Corphita

USA . 1,441 parts In-Stock

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Microchip USA

USA . 490 parts In-Stock

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UHIMA Technologies

Türkiye . 308 parts In-Stock

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Corohmni

South Africa . 118 parts In-Stock

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Overview

Upgrade your electronics with the MC74VHCT125ADTR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality bus drivers and transceivers like this one that guarantee reliability and efficiency. Ideal for a wide range of applications, this product offers unmatched value, benefits, and advantages to customers seeking high performance and precision. Trust Onsemi to provide cutting-edge technology that meets all your needs and exceeds your expectations. Elevate your projects with the MC74VHCT125ADTR2G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for long-term usage.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making this product efficient for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of electronic systems and devices.

Output Characteristics: 3-STATE

3-STATE output allows for high flexibility in controlling the output signal, enhancing the versatility of this product for various applications.

Technical Specifications

Bus Driver & Transceivers MC74VHCT125ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

1.65 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

MC74VHCT125ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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