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MC74VHC1GT125DT1G

Onsemi

MC74VHC1GT125DT1G by Onsemi

MC74VHC1GT125DT1G by Onsemi is a 3.3V bus driver with 16ns propagation delay, operating b/w -55 to 125 °C. It features a small outline package with dual terminals and true output polarity, suitable for military-grade applications requiring compact design and fast signal transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,862 parts In-Stock

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Digiode

USA . 2,007 parts In-Stock

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AZTECH Wire

Italy . 269 parts In-Stock

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$9.320

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Metaverse IC Inc.

Canada . 80,100 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,895 parts In-Stock

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Kulean Microsystems

USA . 7,999 parts In-Stock

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TANS Electronics

Latvia . 7,610 parts In-Stock

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Problanco Electronics

Mexico . 6,127 parts In-Stock

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SupplyDigital Components

Austria . 5,167 parts In-Stock

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Corphita

USA . 2,155 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,845 parts In-Stock

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Corohmni

South Africa . 405 parts In-Stock

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Microchip USA

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Kepictronics

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UHIMA Technologies

Türkiye . 112 parts In-Stock

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Overview

Enhance your electronics projects with the MC74VHC1GT125DT1G by Onsemi, a top-of-the-line Bus Driver & Transceiver. Onsemi is renowned for its high-quality components, and this product is no exception. With a nominal supply voltage of 3.3V and a propagation delay of just 16ns, this versatile device is perfect for a wide range of applications. Whether you're looking to improve signal transmission or enhance circuit performance, the MC74VHC1GT125DT1G delivers unmatched value, reliability, and efficiency. Upgrade your projects today with Onsemi's exceptional technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for rugged use in a bus driver application.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Works efficiently with standard 3.3V power supply, ensuring compatibility with common voltage systems.

Propagation Delay (tpd): 16 ns

Low propagation delay ensures fast and efficient signal transmission, crucial for bus driver applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in varying environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for more flexibility and control over the output signal, enhancing the product's functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers MC74VHC1GT125DT1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

Length:

3 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.5 mm

Trade Compliance

MC74VHC1GT125DT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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