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MC74VHC1G125P5T5G-L22088

Onsemi

MC74VHC1G125P5T5G-L22088 by Onsemi

MC74VHC1G125P5T5G-L22088 by Onsemi is a 3-STATE bus driver with 18ns propagation delay, 80A max I (ol), and 50pF load capacitance. It operates b/w -55 to 125 °C and is ideal for unidirectional control applications requiring a small outline, very thin profile package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 99,133 parts In-Stock

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USA . 99,133 parts In-Stock

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Vyrian

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Digiode

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Microchip USA

USA . 9,918 parts In-Stock

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AZTECH Wire

Italy . 613 parts In-Stock

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Kulean Microsystems

USA . 5,724 parts In-Stock

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TANS Electronics

Latvia . 4,525 parts In-Stock

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SupplyDigital Components

Austria . 1,842 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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Corohmni

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Problanco Electronics

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Overview

Enhance your electronic projects with the MC74VHC1G125P5T5G-L22088 by Onsemi. This bus driver & transceiver offers top-notch quality and reliability, thanks to its manufacturer's reputation for excellence. Ideal for a wide range of applications, this versatile component provides customers with value and benefits that go beyond just functionality. Experience seamless performance and enhanced results with the MC74VHC1G125P5T5G-L22088 - a game-changer in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and allows for a lightweight design, making the product easy to handle and install.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and enabling a streamlined assembly process.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this product compatible with a wide range of systems and ensures reliable performance.

Propagation Delay (tpd): 18 ns

Low propagation delay of 18 ns ensures fast and efficient signal transmission, ideal for high-speed data communication applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can withstand high temperature environments, ensuring reliable performance in harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers MC74VHC1G125P5T5G-L22088 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-F5

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

80 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

18 ns

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

.8 mm

Trade Compliance

MC74VHC1G125P5T5G-L22088 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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