Loading...

MC74LVX573MELG

Onsemi

MC74LVX573MELG by Onsemi

MC74LVX573MELG by Onsemi is an 8-bit bus driver with 3-STATE output. It has a propagation delay of 14.5 ns at Vsup of 2.7V, making it ideal for industrial applications requiring fast signal transmission in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,806 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,806

-

-

-

-

Digiode

USA . 2,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,385

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$17.230

100+ parts

-

1k+ parts

-

10k+ parts

-

660

$17.230

-

-

-

TANS Electronics

Latvia . 6,482 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,482

-

-

-

-

SupplyDigital Components

Austria . 4,055 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,055

-

-

-

-

Problanco Electronics

Mexico . 2,483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,483

-

-

-

-

Kulean Microsystems

USA . 619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

619

-

-

-

-

Corphita

USA . 444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

444

-

-

-

-

UHIMA Technologies

Türkiye . 218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

218

-

-

-

-

Corohmni

South Africa . 163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

163

-

-

-

-

Microchip USA

USA . 113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

113

-

-

-

-

Overview

Enhance your electronic projects with the MC74LVX573MELG by Onsemi, a top-tier manufacturer known for exceptional quality and reliability. This bus driver & transceiver offers seamless integration and efficient data transfer, making it perfect for a wide range of applications. With a nominal supply voltage of 3.3V and a propagation delay of just 14.5 ns, this product provides fast and accurate performance. Trust Onsemi to deliver cutting-edge technology in a compact package, ensuring maximum value and functionality for all your design needs. Upgrade your projects today with the MC74LVX573MELG and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and cost-effective while providing durability and protection to the internal components.

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast operation and efficient signal transmission, making this product suitable for high-speed bus driver applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 2.7

Operates at a low nominal supply voltage, making it energy-efficient and suitable for low-power applications.

Output Characteristics: 3-STATE

3-STATE output allows for tristate control, enabling the bus drivers to disconnect from the bus lines when not in use, reducing power consumption and preventing signal conflicts.

Technical Specifications

Bus Driver & Transceivers MC74LVX573MELG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LVX573MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20