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MC74LVX259D

Onsemi

MC74LVX259D by Onsemi

MC74LVX259D by Onsemi is an 8-bit decoder with 14ns propagation delay and 3.3V power supply. It features a small outline package, operates in industrial temperature range, and has 16 terminals. Ideal for applications requiring fast decoding with low power consumption.

Median Price

$0.119

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 932 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

932

-

$0.119

$0.099

$0.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 94 parts In-Stock

1+ parts

$0.078

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94

$0.078

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Digiode

USA . 1,136 parts In-Stock

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$0.093

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$0.093

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Vyrian

USA . 4,109 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 222 parts In-Stock

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$0.078

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222

$0.078

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Corphita

USA . 2,098 parts In-Stock

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$0.088

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2,098

$0.088

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AZTECH Wire

Italy . 976 parts In-Stock

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$9.710

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976

$9.710

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Problanco Electronics

Mexico . 6,455 parts In-Stock

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6,455

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Kulean Microsystems

USA . 3,668 parts In-Stock

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SupplyDigital Components

Austria . 1,185 parts In-Stock

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TANS Electronics

Latvia . 1,069 parts In-Stock

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1,069

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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Microchip USA

USA . 384 parts In-Stock

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Overview

Upgrade your circuit designs with the MC74LVX259D from Onsemi, a leading manufacturer known for top-quality components. This decoder and driver chip offers lightning-fast 15 ns propagation delay, ensuring efficient data processing in various applications. With 3-STATE output characteristics and a wide temperature range, this versatile product is perfect for industrial use. Trust Onsemi to deliver reliable solutions that enhance performance and streamline operations. Experience the difference with the MC74LVX259D - your key to optimized electronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, increasing flexibility for different applications.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to integrate into existing circuit designs.

No. of Bits: 8

Suitable for applications requiring 8-bit decoding and driving capabilities.

Nominal Supply Voltage / Vsup (V): 2.7

Optimal voltage level for reliable and efficient operation.

Load Capacitance (CL): 50 pF

Capable of driving loads up to 50 pF, suitable for various circuit configurations.

Power Supplies (V): 3.3

Compatible with standard power supply voltages, making integration into existing systems easy.

No. of Terminals: 16

Sufficient number of terminals for connecting to external circuits and components.

Package Style (Meter): SMALL OUTLINE

Compact and space-saving design, suitable for applications with limited board space.

Maximum I (ol): 4 Amp

Capable of driving higher current loads, offering versatility in design options.

Propagation Delay (tpd): 15 ns

Low propagation delay ensures fast signal processing, enhancing overall performance.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with higher temperature requirements.

Output Characteristics: 3-STATE

3-state outputs allow for high impedance states, providing flexibility in controlling output signals.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments, expanding the range of possible applications.

Terminal Finish: TIN LEAD

Tin lead finish offers good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal positioning provides stability and ease of soldering during assembly.

Maximum Seated Height: 1.75 mm

Low profile design is suitable for applications with height restrictions.

Width: 3.9 mm

Compact width allows for efficient use of board space.

Output Polarity: TRUE

True output polarity ensures correct signal transmission, reducing errors in data processing.

Minimum Supply Voltage (Vsup): 2 V

Capable of operating at low supply voltages, conserving power in energy-efficient applications.

Peak Reflow Temperature °C: 235

Capable of withstanding high-temperature soldering processes during assembly.

Length: 9.9 mm

Compact length suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for various applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Packing Method: RAIL

Rail packaging facilitates automated assembly processes, improving efficiency in large-scale production.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts and designs.

Maximum Supply Voltage (Vsup): 3.6 V

Supports higher supply voltages, offering flexibility in different power supply configurations.

Technical Specifications

Decoder & Drivers MC74LVX259D attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74LVX259D Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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