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MC74HCT574ANG

Onsemi

MC74HCT574ANG by Onsemi

MC74HCT574ANG by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a max frequency of 20MHz. It has a supply voltage range of 4.5V to 5.5V and can handle load capacitance up to 50pF. Ideal for applications requiring positive edge triggering and fast propagation delay of 45ns.

Median Price

$0.440

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28,831 parts In-Stock

1+ parts

$0.440

100+ parts

$0.430

1k+ parts

$0.420

10k+ parts

-

28,831

$0.440

$0.430

$0.420

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 505 parts In-Stock

1+ parts

$0.497

100+ parts

-

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-

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505

$0.497

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Vyrian

USA . 7,778 parts In-Stock

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-

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7,778

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Distributors (Availability)

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Corphita

USA . 2,325 parts In-Stock

1+ parts

$0.471

100+ parts

-

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2,325

$0.471

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Corohmni

South Africa . 455 parts In-Stock

1+ parts

$0.476

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455

$0.476

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Component Stockers USA

USA . 40,789 parts In-Stock

1+ parts

$0.500

100+ parts

$0.470

1k+ parts

$0.430

10k+ parts

$0.430

40,789

$0.500

$0.470

$0.430

$0.430

AZTECH Wire

Italy . 682 parts In-Stock

1+ parts

$16.200

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682

$16.200

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$26.781

100+ parts

$24.371

1k+ parts

$21.960

10k+ parts

-

500

$26.781

$24.371

$21.960

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Continental Prestige Electronics

USA . 28,831 parts In-Stock

1+ parts

-

100+ parts

$0.423

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28,831

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$0.423

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Problanco Electronics

Mexico . 7,149 parts In-Stock

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7,149

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TANS Electronics

Latvia . 6,468 parts In-Stock

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6,468

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Kulean Microsystems

USA . 6,245 parts In-Stock

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6,245

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A-Z Elektronik GmbH

Germany . 6,224 parts In-Stock

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6,224

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SupplyDigital Components

Austria . 1,826 parts In-Stock

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1,826

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UHIMA Technologies

Türkiye . 636 parts In-Stock

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636

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Speed Components Ltd (Excess)

Israel . 617 parts In-Stock

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617

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Microchip USA

USA . 365 parts In-Stock

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365

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Overview

Unlock seamless data transmission with the MC74HCT574ANG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Bus Driver & Transceivers like this one, designed to meet your connectivity needs. With a 3-STATE output characteristic and a maximum operating temperature of 125 °C, this product offers unparalleled reliability and performance. Perfect for applications requiring fast signal propagation, the MC74HCT574ANG ensures efficient data transfer with minimal delay. Elevate your projects with this versatile component and experience the difference it can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation for the internal components, ensuring a longer lifespan for the product.

No. of Bits: 8

Provides sufficient data transmission capabilities for bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common power supply standards, making it easy to integrate into existing systems.

Propagation Delay (tpd): 45 ns

Low propagation delay ensures quick response time in data transmission, improving overall efficiency.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments.

Technology: CMOS

CMOS technology offers low power consumption, reducing energy costs and heat dissipation.

Maximum Frequency At Nominal Supply: 20000000 Hz

Supports high-frequency operations for efficient data transmission in bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers MC74HCT574ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

MC74HCT574ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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