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MC74HCT244AFG

Onsemi

MC74HCT244AFG by Onsemi

MC74HCT244AFG by Onsemi is a 20-terminal bus driver with 30ns propagation delay at 5V. It features 3-STATE output characteristics and operates in temperatures ranging from -55 to 125 °C. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

$0.512

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,196 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

7,196

-

$0.502

$0.417

$0.371

Verical

USA . 3,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.521

10k+ parts

$0.464

3,080

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,163 parts In-Stock

1+ parts

$0.391

100+ parts

-

1k+ parts

-

10k+ parts

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2,163

$0.391

-

-

-

Vyrian

USA . 6,015 parts In-Stock

1+ parts

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100+ parts

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6,015

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,411 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

-

10k+ parts

-

1,411

$0.371

-

-

-

Corohmni

South Africa . 211 parts In-Stock

1+ parts

$0.412

100+ parts

-

1k+ parts

-

10k+ parts

-

211

$0.412

-

-

-

AZTECH Wire

Italy . 941 parts In-Stock

1+ parts

$10.340

100+ parts

-

1k+ parts

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10k+ parts

-

941

$10.340

-

-

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SupplyDigital Components

Austria . 8,141 parts In-Stock

1+ parts

-

100+ parts

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8,141

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-

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Continental Prestige Electronics

USA . 7,196 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

-

10k+ parts

-

7,196

-

$0.357

-

-

Problanco Electronics

Mexico . 6,628 parts In-Stock

1+ parts

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6,628

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TANS Electronics

Latvia . 3,818 parts In-Stock

1+ parts

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3,818

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Microchip USA

USA . 3,285 parts In-Stock

1+ parts

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100+ parts

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3,285

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Kulean Microsystems

USA . 3,245 parts In-Stock

1+ parts

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3,245

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UHIMA Technologies

Türkiye . 751 parts In-Stock

1+ parts

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751

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Andel Nordic

Denmark . 576 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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576

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Overview

Enhance your electronic designs with the MC74HCT244AFG by Onsemi, a top-tier manufacturer known for superior quality and reliability. This Bus Driver & Transceiver product offers fast propagation delay, true output polarity, and 3-state output characteristics, making it ideal for a wide range of applications. With a compact design and dual terminal position, this component provides customers with exceptional value, efficiency, and performance. Upgrade your projects today with the MC74HCT244AFG and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 30 ns

With a low propagation delay at nominal supply, this product ensures fast and efficient data transmission, making it suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto circuit boards, saving space and allowing for automated assembly processes.

No. of Functions: 2

Having multiple functions in a single device reduces the need for additional components, simplifying the circuit design and potentially lowering overall costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of systems and power sources, increasing its versatility.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures optimal performance and stability of the product when interfacing with external components, enhancing overall system reliability.

Power Supplies (V): 5

Consistent power supply at 5V ensures reliable operation of the product under normal operating conditions, maintaining consistent performance.

Maximum I (ol): 6 Amp

With a high output current capability of 6A, this product can drive demanding loads without risk of overheating or damage, making it suitable for robust applications.

Output Characteristics: 3-STATE

The 3-STATE output feature allows the product to drive multiple loads, control data flow, and easily interface with other components, providing flexibility in system design.

Temperature Grade: MILITARY

Being rated for military-grade temperatures, this product can withstand extreme environmental conditions and operate reliably in harsh environments, making it suitable for rugged applications.

Technical Specifications

Bus Driver & Transceivers MC74HCT244AFG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC74HCT244AFG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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