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MC74HC541AFG

Onsemi

MC74HC541AFG by Onsemi

MC74HC541AFG by Onsemi is an 8-bit bus driver with 28ns propagation delay, operating at 3V. It features a small outline package and true output polarity. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.471

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,248 parts In-Stock

1+ parts

-

100+ parts

$0.462

1k+ parts

$0.384

10k+ parts

$0.342

3,248

-

$0.462

$0.384

$0.342

Verical

USA . 1,916 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.480

10k+ parts

-

1,916

-

-

$0.480

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,263 parts In-Stock

1+ parts

$0.360

100+ parts

-

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1,263

$0.360

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-

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Vyrian

USA . 2,681 parts In-Stock

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-

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2,681

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,771 parts In-Stock

1+ parts

$0.322

100+ parts

-

1k+ parts

-

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-

2,771

$0.322

-

-

-

Corphita

USA . 2,294 parts In-Stock

1+ parts

$0.341

100+ parts

-

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-

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-

2,294

$0.341

-

-

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Corohmni

South Africa . 371 parts In-Stock

1+ parts

$0.379

100+ parts

-

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371

$0.379

-

-

-

AZTECH Wire

Italy . 419 parts In-Stock

1+ parts

$8.290

100+ parts

-

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419

$8.290

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 27,951 parts In-Stock

1+ parts

-

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27,951

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TANS Electronics

Latvia . 4,759 parts In-Stock

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4,759

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Kulean Microsystems

USA . 4,523 parts In-Stock

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4,523

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Microchip USA

USA . 4,405 parts In-Stock

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4,405

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Continental Prestige Electronics

USA . 3,248 parts In-Stock

1+ parts

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100+ parts

$0.329

1k+ parts

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3,248

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$0.329

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Problanco Electronics

Mexico . 2,688 parts In-Stock

1+ parts

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2,688

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SupplyDigital Components

Austria . 2,128 parts In-Stock

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2,128

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UHIMA Technologies

Türkiye . 881 parts In-Stock

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881

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Overview

Experience seamless data transmission with the MC74HC541AFG bus driver & transceiver from Onsemi. Known for their high-quality products, Onsemi delivers reliability and performance in every component. This versatile device is perfect for a wide range of applications, offering customers value and benefits like fast propagation delay, low power consumption, and true output polarity. Upgrade your system with the MC74HC541AFG and enjoy efficient operation at a nominal supply voltage of 3V. Trust Onsemi for top-notch solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the bus driver & transceivers lightweight and durable, perfect for use in various applications.

Propagation Delay At Nominal Supply: 28 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration onto circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard supply voltage of 3V, making it compatible with a wide range of systems and devices.

Output Characteristics: 3-STATE

3-STATE output allows for efficient control over the bus lines, enabling easy switching between high impedance and active states.

Technical Specifications

Bus Driver & Transceivers MC74HC541AFG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

165 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC74HC541AFG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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