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MC74HC540ANG

Onsemi

MC74HC540ANG by Onsemi

MC74HC540ANG by Onsemi is an 8-bit bus driver with 28ns propagation delay. It operates at a nominal voltage of 3V and supports load capacitance of 50pF. Ideal for applications requiring fast signal transmission in military-grade environments.

Median Price

$0.422

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 14 parts In-Stock

1+ parts

$0.422

100+ parts

$0.422

1k+ parts

$0.422

10k+ parts

$0.422

14

$0.422

$0.422

$0.422

$0.422

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,126 parts In-Stock

1+ parts

$0.401

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2,126

$0.401

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Nova Conductors

Japan . 50 parts In-Stock

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$0.600

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50

$0.600

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Vyrian

USA . 6,031 parts In-Stock

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J2 Sourcing AB

Sweden . 927 parts In-Stock

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927

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Semtec, LLC

USA . 138 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14 parts In-Stock

1+ parts

$0.359

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14

$0.359

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Corphita

USA . 683 parts In-Stock

1+ parts

$0.380

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683

$0.380

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Corohmni

South Africa . 109 parts In-Stock

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$0.422

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109

$0.422

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Continental Prestige Electronics

USA . 5,253 parts In-Stock

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$0.596

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$0.584

5,253

$0.596

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$0.584

Argo Parts USA

USA . 3,148 parts In-Stock

1+ parts

$0.596

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$0.578

3,148

$0.596

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$0.578

Bastille Electronics

Australia . 3,919 parts In-Stock

1+ parts

$0.600

100+ parts

$0.570

1k+ parts

$0.542

10k+ parts

$0.534

3,919

$0.600

$0.570

$0.542

$0.534

AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$10.107

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386

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TANS Electronics

Latvia . 6,192 parts In-Stock

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SupplyDigital Components

Austria . 4,204 parts In-Stock

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Kulean Microsystems

USA . 1,838 parts In-Stock

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Problanco Electronics

Mexico . 901 parts In-Stock

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UHIMA Technologies

Türkiye . 813 parts In-Stock

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Microchip USA

USA . 190 parts In-Stock

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Overview

Enhance your electronic circuits with the MC74HC540ANG from Onsemi, a top-tier manufacturer known for their superior quality products. This bus driver and transceiver offers seamless communication between components, with 8 bits of data transmission and a fast propagation delay of just 28 ns. Whether you're designing industrial control systems or automotive applications, this component delivers reliable performance and efficiency. Trust Onsemi to provide cutting-edge technology that meets your needs, giving you a competitive edge in the market. Upgrade your projects with the MC74HC540ANG and experience the difference in quality and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for transportation applications.

Propagation Delay: 28 ns

With a fast propagation delay of 28 ns, this bus driver ensures quick and efficient data transmission, making it suitable for high-speed communication systems.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving space on the circuit board and allowing for efficient layout designs.

No. of Bits: 8

The 8-bit configuration of this bus driver allows for a wide range of data processing capabilities, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V, this bus driver offers a balance between power efficiency and performance, suitable for battery-powered devices.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures stable signal transmission and reception, making this bus driver reliable for data communication in noisy environments.

Power Supplies (V): 2/6

Supporting power supplies ranging from 2V to 6V, this bus driver offers flexibility in voltage requirements, making it compatible with a wide range of systems.

No. of Terminals: 20

With 20 terminals, this bus driver allows for versatile connectivity options, enabling integration into complex electronic systems easily.

Package Style (Meter): IN-LINE

The in-line package style simplifies the installation process and enhances the overall aesthetics of the circuit design, making it user-friendly.

Maximum I (ol): 6 Amp

With a maximum output current of 6 Amps, this bus driver can drive high-power loads efficiently, making it suitable for driving multiple devices simultaneously.

Technical Specifications

Bus Driver & Transceivers MC74HC540ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC74HC540ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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