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MC74HC245ANG

Onsemi

MC74HC245ANG by Onsemi

MC74HC245ANG by Onsemi is an 8-bit bus driver with a propagation delay of 22ns at 3V. It features a max operating temperature of 125°C and output polarity is TRUE. Commonly used in bidirectional control applications due to its CMOS technology and 3-STATE output characteristics.

Median Price

$0.738

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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$0.738

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Vyrian

USA . 8,753 parts In-Stock

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ComSIT Distribution GmbH

Germany . 216 parts In-Stock

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Digiode

USA . 89 parts In-Stock

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PC Components Company LLC

USA . 10 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,710 parts In-Stock

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$0.738

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$0.723

4,710

$0.738

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$0.723

Argo Parts USA

USA . 2,648 parts In-Stock

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$0.738

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$0.738

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Netroflash

USA . 1,000 parts In-Stock

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$0.738

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$0.723

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$0.738

$0.723

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AZTECH Wire

Italy . 703 parts In-Stock

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$16.771

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$16.771

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Aztec Data Supply Inc.

USA . 2,131 parts In-Stock

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$17.733

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Semicontronic

India . 427 parts In-Stock

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$23.000

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$22.425

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$22.310

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427

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Ampacity Inc.

Singapore . 732 parts In-Stock

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$65.000

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Kulean Microsystems

USA . 8,151 parts In-Stock

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Problanco Electronics

Mexico . 6,804 parts In-Stock

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TANS Electronics

Latvia . 3,020 parts In-Stock

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Corphita

USA . 1,175 parts In-Stock

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SupplyDigital Components

Austria . 851 parts In-Stock

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UHIMA Technologies

Türkiye . 447 parts In-Stock

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Corohmni

South Africa . 427 parts In-Stock

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Microchip USA

USA . 302 parts In-Stock

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Overview

Experience top-notch quality and reliability with the MC74HC245ANG by Onsemi, a leading manufacturer known for cutting-edge technology. This bus driver & transceiver offers seamless communication with its 8-bit design and 3-state output characteristics, making it perfect for various applications. With a nominal supply voltage of 3V, this product guarantees efficient performance while delivering a propagation delay of just 22ns. Elevate your projects with the value and benefits that this versatile component brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making this product suitable for rugged conditions.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast and efficient signal transmission, crucial for real-time applications in bus driver and transceiver systems.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with common power sources and efficient power consumption.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, enabling flexibility in bus communication and reducing signal interference.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable performance in extreme temperature conditions, common in military and industrial applications.

Technical Specifications

Bus Driver & Transceivers MC74HC245ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Translation:

N/A

Width:

7.62 mm

Trade Compliance

MC74HC245ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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