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MC74HC244AFG

Onsemi

MC74HC244AFG by Onsemi

MC74HC244AFG by Onsemi is a 20-terminal bus driver with 27ns propagation delay, operating b/w -55 to 125 °C. It has 2 functions, true output polarity, and supports a load capacitance of 50pF. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.568

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 474 parts In-Stock

1+ parts

-

100+ parts

$0.568

1k+ parts

$0.471

10k+ parts

$0.420

474

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$0.568

$0.471

$0.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 252 parts In-Stock

1+ parts

$0.443

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252

$0.443

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Vyrian

USA . 6,122 parts In-Stock

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6,122

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Distributors (Availability)

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Corphita

USA . 551 parts In-Stock

1+ parts

$0.419

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551

$0.419

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Corohmni

South Africa . 255 parts In-Stock

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$0.466

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255

$0.466

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AZTECH Wire

Italy . 388 parts In-Stock

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$19.450

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388

$19.450

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Problanco Electronics

Mexico . 5,726 parts In-Stock

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TANS Electronics

Latvia . 3,495 parts In-Stock

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3,495

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Kulean Microsystems

USA . 2,605 parts In-Stock

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2,605

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SupplyDigital Components

Austria . 1,755 parts In-Stock

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Microchip USA

USA . 220 parts In-Stock

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Kepictronics

USA . 167 parts In-Stock

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UHIMA Technologies

Türkiye . 74 parts In-Stock

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Overview

Experience seamless data transmission with the MC74HC244AFG by Onsemi, a top-tier manufacturer known for superior quality and reliability. This Bus Driver & Transceivers category product offers fast propagation delay, making it ideal for high-speed applications. With its 3-state output characteristics and true output polarity, this device ensures smooth operation. Its small outline package and dual terminals make installation a breeze. Trust Onsemi to deliver cutting-edge technology that meets your needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the product, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 27 ns

Low propagation delay ensures fast and efficient operation of the bus driver & transceivers.

Surface Mount: YES

Surface mount capability makes it easy to integrate into electronic circuits and PCB designs.

No. of Functions: 2

Having multiple functions in a single device improves space efficiency and simplifies circuit designs.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and mounting on PCBs.

No. of Bits: 4

4-bit capability provides versatility in data processing and transmission.

Nominal Supply Voltage / Vsup (V): 3

Operating at a moderate supply voltage of 3V ensures compatibility with various systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable performance and signal integrity.

Power Supplies (V): 2/6

Support for multiple power supply voltages allows flexibility in system integration and design.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options and versatility in circuit connections.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and improves overall compactness of the design.

Maximum I (ol): 6 Amp

High output current capability supports driving of larger loads, enhancing the product's versatility.

Propagation Delay (tpd): 135 ns

Despite having low propagation delay, this longer delay allows for precise signal timing when needed.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability in various environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for flexible control of output signals, improving system functionality.

Minimum Operating Temperature: -55 °C

Wide temperature range enables operation in extreme cold conditions, making the product suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options on the PCB.

No. of Ports: 2

Having 2 ports provides connectivity options and flexibility in data transmission.

Maximum Seated Height: 2.05 mm

Low seated height saves space on the PCB and enhances overall compactness.

Width: 5.275 mm

Narrow width allows for easy integration into compact electronic designs.

Output Polarity: TRUE

True output polarity ensures compatibility and seamless integration with other components in the system.

Minimum Supply Voltage (Vsup): 2 V

Support for low minimum supply voltage enables operation in low power scenarios.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliability during soldering and assembly processes.

Length: 12.575 mm

Moderate length allows for easy placement on the PCB without taking up too much space.

Temperature Grade: MILITARY

Military-grade temperature rating ensures operation in rugged and harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical connections and ease of soldering during assembly.

Packing Method: RAIL

Rail packing method enables easy handling and storage of multiple units for production purposes.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration into common PCB layouts and designs.

Control Type: ENABLE LOW

Enable low control type offers flexibility in activating and deactivating the device, enhancing system control.

Maximum Supply Voltage (Vsup): 6 V

Support for high maximum supply voltage allows for compatibility with various power sources and systems.

Technical Specifications

Bus Driver & Transceivers MC74HC244AFG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74HC244AFG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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