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MC74HC240ANG

Onsemi

MC74HC240ANG by Onsemi

MC74HC240ANG by Onsemi is a 20-terminal CMOS bus driver with 24ns propagation delay and 4-bit capacity. It operates at supply voltages of 2-6V, suitable for military-grade applications requiring inverted output polarity and 3-state output characteristics. The package style is in-line with a rectangular shape, making it ideal for through-hole mounting in various electronic systems.

Median Price

$0.481

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$0.481

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Vyrian

USA . 5,920 parts In-Stock

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Digiode

USA . 1,480 parts In-Stock

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Flex Direct, LLC

USA . 1,085 parts In-Stock

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Bristol Electronics

USA . 585 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 144 parts In-Stock

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Holdelec - ElecDif-Pro

France . 144 parts In-Stock

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Connector Distribution Corp

USA . 29 parts In-Stock

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Right Parts Inc.

USA . 29 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 20 parts In-Stock

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EMSNET

USA . 18 parts In-Stock

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Distributors (Availability)

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Netroflash

USA . 500 parts In-Stock

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$0.481

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$0.457

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$0.447

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$0.481

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$0.457

$0.447

Corohmni

South Africa . 78 parts In-Stock

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$0.697

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Ampacity Inc.

Singapore . 9,882 parts In-Stock

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$1.290

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Benley Electronics

USA . 6 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 439 parts In-Stock

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$18.330

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Continental Prestige Electronics

USA . 9,943 parts In-Stock

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$0.432

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Kulean Microsystems

USA . 7,710 parts In-Stock

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Problanco Electronics

Mexico . 6,467 parts In-Stock

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SupplyDigital Components

Austria . 6,428 parts In-Stock

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Microchip USA

USA . 5,147 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,556 parts In-Stock

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TANS Electronics

Latvia . 2,473 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 7 parts In-Stock

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Overview

Discover the MC74HC240ANG by Onsemi, a high-quality bus driver & transceiver designed to deliver seamless communication in various applications. With Onsemi's reputation for excellence, this product ensures reliability and superior performance. Experience the value of fast propagation delay, low power consumption, and 3-state output characteristics. Customers can trust in the benefits of inverted output polarity, MILITARY-grade temperature tolerance, and convenient through-hole terminal form. Upgrade your projects with the MC74HC240ANG for efficient and effective data transmission.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material ensures durability and ruggedness, making it suitable for harsh environments.

No. of Functions: 2

Having 2 functions allows for efficient signal transmission and reception, improving overall performance.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures energy efficiency and compatibility with a wide range of systems.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance when disabled, reducing power consumption and signal interference.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product reliable and efficient.

Technical Specifications

Bus Driver & Transceivers MC74HC240ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

AMMO PACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC74HC240ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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