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MC74HC139AFELG

Onsemi

MC74HC139AFELG by Onsemi

MC74HC139AFELG by Onsemi is a 16-terminal decoder with 35ns propagation delay and 175ns tpd. It operates at -55 to 125 °C, suitable for military-grade applications requiring inverted output polarity and dual terminal position.

Median Price

$0.364

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,329 parts In-Stock

1+ parts

-

100+ parts

$0.343

1k+ parts

$0.285

10k+ parts

$0.254

2,329

-

$0.343

$0.285

$0.254

Verical

USA . 1,391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.386

10k+ parts

$0.356

1,391

-

-

$0.386

$0.356

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 208 parts In-Stock

1+ parts

$0.268

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208

$0.268

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Vyrian

USA . 4,483 parts In-Stock

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4,483

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,868 parts In-Stock

1+ parts

$0.228

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2,868

$0.228

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Corphita

USA . 1,722 parts In-Stock

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$0.254

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1,722

$0.254

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Corohmni

South Africa . 184 parts In-Stock

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$0.268

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184

$0.268

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AZTECH Wire

Italy . 1,104 parts In-Stock

1+ parts

$14.240

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1,104

$14.240

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Problanco Electronics

Mexico . 6,833 parts In-Stock

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6,833

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Kulean Microsystems

USA . 4,823 parts In-Stock

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SupplyDigital Components

Austria . 4,234 parts In-Stock

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Microchip USA

USA . 3,285 parts In-Stock

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3,285

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TANS Electronics

Latvia . 2,745 parts In-Stock

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Continental Prestige Electronics

USA . 2,329 parts In-Stock

1+ parts

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100+ parts

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$0.242

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2,329

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$0.242

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UHIMA Technologies

Türkiye . 836 parts In-Stock

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836

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Overview

Experience top-notch performance and reliability with the MC74HC139AFELG decoder & driver by Onsemi. With a reputation for superior quality and cutting-edge technology, Onsemi delivers unmatched value to customers. This versatile product is ideal for a wide range of applications, providing seamless functionality and efficient operation. Trust Onsemi to deliver the best in class products that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Propagation Delay At Nominal Supply: 35 ns

With a fast propagation delay, this decoder and driver ensures quick signal processing, improving overall system efficiency.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making this product versatile and easy to use.

Nominal Supply Voltage / Vsup (V): 4.5

The 4.5V nominal supply voltage is a common and stable power source, ensuring reliable operation in various applications.

Output Polarity: INVERTED

Having an inverted output polarity can be advantageous in certain circuit configurations, offering flexibility in signal processing.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this decoder and driver is highly durable and reliable, suitable for demanding environments.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Decoder & Drivers MC74HC139AFELG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

175 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74HC139AFELG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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