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MC74ACT640NG

Onsemi

MC74ACT640NG by Onsemi

MC74ACT640NG by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a supply voltage of 5V. It features a propagation delay of 9ns and can handle a max output current of 24A. Ideal for bidirectional control applications in industrial settings due to its CMOS technology and wide temperature range from -40 °C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,459 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 691 parts In-Stock

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Kulean Microsystems

USA . 7,117 parts In-Stock

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SupplyDigital Components

Austria . 5,393 parts In-Stock

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Problanco Electronics

Mexico . 4,608 parts In-Stock

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Corphita

USA . 708 parts In-Stock

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Microchip USA

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TANS Electronics

Latvia . 271 parts In-Stock

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UHIMA Technologies

Türkiye . 244 parts In-Stock

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Corohmni

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Overview

Boost your project with the reliable and high-quality MC74ACT640NG from Onsemi. As a leading manufacturer in the industry, Onsemi's bus driver & transceivers are designed to meet your needs for seamless data transfer. With its 3-STATE output characteristics and inverted polarity, this product offers exceptional value and performance. Whether you're working on industrial automation, communication systems, or automotive applications, the MC74ACT640NG provides the precision and efficiency you need to take your project to the next level. Experience innovation at its finest with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for transportation applications.

No. of Bits: 8

Having 8 bits allows for a higher data processing capability, making it suitable for handling various signals and data in bus communication.

Nominal Supply Voltage / Vsup (V): 5

Operating at 5V nominal supply voltage ensures compatibility with standard power sources in bus systems.

Propagation Delay (tpd): 9 ns

Low propagation delay of 9ns ensures fast signal transmission, crucial for real-time communication in bus networks.

Output Characteristics: 3-STATE

3-state output allows the driver to control the bus lines by driving them to active high, active low, or high impedance states, enhancing flexibility in bus communication.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range of -40 to 85 °C ensures reliable operation in harsh environmental conditions often encountered in bus systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy bus environments.

Technical Specifications

Bus Driver & Transceivers MC74ACT640NG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

7.62 mm

Trade Compliance

MC74ACT640NG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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