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MC74ACT541MG

Onsemi

MC74ACT541MG by Onsemi

MC74ACT541MG by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage of 5V, has a propagation delay of 8ns, and can handle load capacitance up to 50pF. Ideal for industrial applications requiring fast signal transmission in compact spaces due to its small outline package style and surface mount capability.

Median Price

$0.502

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 449 parts In-Stock

1+ parts

-

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$0.502

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$0.417

10k+ parts

$0.371

449

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$0.502

$0.417

$0.371

Distributors (In-Stock)

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Digiode

USA . 2,263 parts In-Stock

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$0.391

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$0.391

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Vyrian

USA . 6,794 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 359 parts In-Stock

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$0.350

100+ parts

$0.341

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$0.340

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-

359

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$0.340

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Ampacity Inc.

Singapore . 236 parts In-Stock

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$0.350

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Corphita

USA . 539 parts In-Stock

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$0.371

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Corohmni

South Africa . 261 parts In-Stock

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$0.412

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AZTECH Wire

Italy . 602 parts In-Stock

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$7.174

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602

$7.174

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Aztec Data Supply Inc.

USA . 2,497 parts In-Stock

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$30.080

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QUARKTWIN TECHNOLOGY LTD

USA . 29,681 parts In-Stock

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Kulean Microsystems

USA . 6,397 parts In-Stock

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SupplyDigital Components

Austria . 5,643 parts In-Stock

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Continental Prestige Electronics

USA . 5,501 parts In-Stock

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TANS Electronics

Latvia . 4,610 parts In-Stock

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Microchip USA

USA . 4,496 parts In-Stock

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Problanco Electronics

Mexico . 3,828 parts In-Stock

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Argo Parts USA

USA . 801 parts In-Stock

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UHIMA Technologies

Türkiye . 736 parts In-Stock

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Bastille Electronics

Australia . 37 parts In-Stock

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Overview

Enhance your electronic designs with the MC74ACT541MG by Onsemi, a high-quality Bus Driver & Transceiver. Onsemi is known for its reliability and innovation in the semiconductor industry, making this product a top choice for engineers and hobbyists alike. With a fast propagation delay of 8.5 ns and 3-STATE output characteristics, this device ensures seamless communication between components. Whether you're working on industrial automation or consumer electronics, this versatile chip offers exceptional value, performance, and ease of integration. Experience the difference with Onsemi's MC74ACT541MG and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, durable, and resistant to impact, making this product suitable for rugged environments such as automotive applications.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed communication systems.

Surface Mount: YES

Surface mount packaging enables easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Bits: 8

8-bit operation provides sufficient data handling capacity for various communication protocols and applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with many electronic systems and power sources.

Load Capacitance (CL): 50 pF

The appropriate load capacitance ensures signal integrity and stability in communication channels, improving overall performance.

Power Supplies (V): 5

Consistent power supply at 5V ensures reliable operation and compatibility with standard voltage levels in electronic devices.

No. of Terminals: 20

With 20 terminals, this product offers versatile connectivity options for interfacing with other components and systems.

Maximum I (ol): 24 Amp

High output current capability of 24A allows for driving various loads with ease, catering to a wide range of applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40 to 85°C ensures functionality in extreme environments and temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable operation, making this product energy-efficient and robust.

Technical Specifications

Bus Driver & Transceivers MC74ACT541MG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74ACT541MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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