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MC74ACT540MELG

Onsemi

MC74ACT540MELG by Onsemi

MC74ACT540MELG by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage of 5V, has a propagation delay of 8.5ns, and can handle a load capacitance of 50pF. Ideal for industrial applications requiring inverted output polarity and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,249 parts In-Stock

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Digiode

USA . 808 parts In-Stock

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808

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AZTECH Wire

Italy . 423 parts In-Stock

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$10.370

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Component Stockers USA

USA . 576 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,468 parts In-Stock

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Kulean Microsystems

USA . 5,626 parts In-Stock

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TANS Electronics

Latvia . 5,159 parts In-Stock

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Corphita

USA . 1,876 parts In-Stock

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UHIMA Technologies

Türkiye . 967 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 384 parts In-Stock

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Problanco Electronics

Mexico . 284 parts In-Stock

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Overview

Enhance your electronics project with the MC74ACT540MELG by Onsemi, a top-tier manufacturer known for quality and reliability. This bus driver & transceiver offers seamless communication between different components, ensuring smooth data flow. With a small outline package and 3-state output characteristics, this product is versatile and practical for various applications. From industrial automation to consumer electronics, the MC74ACT540MELG delivers precision and efficiency. Upgrade your designs today and experience the value and benefits of this exceptional component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan.

No. of Bits: 8

Offers a sufficient number of bits for data transmission and processing, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage level for power supply, ensuring compatibility with most systems.

Propagation Delay (tpd): 8.5 ns

Low propagation delay ensures fast and efficient data transfer, critical for real-time communication.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Bus Driver & Transceivers MC74ACT540MELG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC74ACT540MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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