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MC74AC573DTR2

Onsemi

MC74AC573DTR2 by Onsemi

MC74AC573DTR2 by Onsemi is an 8-bit bus driver with 15ns propagation delay, suitable for industrial applications. It operates at a supply voltage of 3.3/5V and has a max I (ol) of 12Amp. With surface mount capability and dual terminal position, it offers efficient signal transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,512 parts In-Stock

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Rebound Electronics

UK . 2,500 parts In-Stock

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2,500

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Inventory MP

USA . 2,395 parts In-Stock

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2,395

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Bristol Electronics

USA . 2,395 parts In-Stock

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Digiode

USA . 2,368 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 200 parts In-Stock

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$14.540

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200

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Kulean Microsystems

USA . 7,611 parts In-Stock

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Problanco Electronics

Mexico . 6,289 parts In-Stock

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TANS Electronics

Latvia . 2,775 parts In-Stock

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SupplyDigital Components

Austria . 1,142 parts In-Stock

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Corphita

USA . 720 parts In-Stock

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720

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UHIMA Technologies

Türkiye . 509 parts In-Stock

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Microchip USA

USA . 230 parts In-Stock

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Corohmni

South Africa . 72 parts In-Stock

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Overview

Boost your electronic designs with the MC74AC573DTR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality bus drivers and transceivers that guarantee performance and reliability. This versatile product is perfect for a wide range of applications, providing fast propagation delay and 3-state output characteristics. With a package style that is compact and easy to mount, this component offers exceptional value and benefits to customers looking for seamless integration and high-speed data transmission. Trust Onsemi to elevate your projects with cutting-edge technology and superior quality components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 15 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easy and allows for compact design, saving space on the PCB.

No. of Bits: 8

Having 8 bits allows for a wide range of input/output possibilities, making this product versatile in various communication applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard voltage levels in many electronic systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions and operate reliably in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers MC74AC573DTR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74AC573DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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