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MC74AC245DTR2

Onsemi

MC74AC245DTR2 by Onsemi

MC74AC245DTR2 by Onsemi is an 8-bit bus driver with 9ns propagation delay at 5V. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and supports bidirectional control applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,134 parts In-Stock

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Digiode

USA . 1,568 parts In-Stock

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NAC Semi

USA . 300 parts In-Stock

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300

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Distributors (Availability)

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AZTECH Wire

Italy . 542 parts In-Stock

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$11.330

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Component Stockers USA

USA . 701 parts In-Stock

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$99.990

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701

$99.990

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TANS Electronics

Latvia . 7,334 parts In-Stock

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Kulean Microsystems

USA . 6,943 parts In-Stock

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SupplyDigital Components

Austria . 6,587 parts In-Stock

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Problanco Electronics

Mexico . 3,561 parts In-Stock

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Corphita

USA . 1,011 parts In-Stock

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UHIMA Technologies

Türkiye . 780 parts In-Stock

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Corohmni

South Africa . 495 parts In-Stock

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Microchip USA

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Overview

Enhance the efficiency and reliability of your electronic devices with the MC74AC245DTR2 by Onsemi, a top-tier manufacturer known for its superior quality and innovative solutions. As a versatile Bus Driver & Transceivers component, this product offers seamless integration, fast propagation delay, and a wide range of applications. With advanced features like 3-STATE output characteristics and common control, customers can experience enhanced performance and flexibility in their designs. Trust Onsemi for cutting-edge technology that delivers value, benefits, and advantages to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 9 ns

Low propagation delay allows for fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easier and more convenient, especially in compact electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with commonly used power supplies.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments where heat may be a concern.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers MC74AC245DTR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

WITH COMMON OUTPUT ENABLE AND DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

4.4 mm

Trade Compliance

MC74AC245DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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