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MC74AC244DTR2

Onsemi

MC74AC244DTR2 by Onsemi

MC74AC244DTR2 by Onsemi is a 20-terminal bus driver with 10ns propagation delay at 5V. It features CMOS technology, operates in industrial temperature range (-40 to 85 °C), and supports dual-port applications. Ideal for enabling low control type with true output polarity, it comes in small outline package suitable for surface mount assembly.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 2,500 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

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$0.500

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2,500

$0.770

$0.580

$0.500

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Vyrian

USA . 2,609 parts In-Stock

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2,609

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Chip Stock

USA . 515 parts In-Stock

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515

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Digiode

USA . 179 parts In-Stock

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179

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Distributors (Availability)

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Corohmni

South Africa . 492 parts In-Stock

1+ parts

$0.770

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492

$0.770

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AZTECH Wire

Italy . 662 parts In-Stock

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$18.120

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662

$18.120

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TANS Electronics

Latvia . 8,147 parts In-Stock

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Kulean Microsystems

USA . 6,208 parts In-Stock

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Problanco Electronics

Mexico . 4,756 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 2,346 parts In-Stock

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Microchip USA

USA . 413 parts In-Stock

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SupplyDigital Components

Austria . 213 parts In-Stock

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UHIMA Technologies

Türkiye . 210 parts In-Stock

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Overview

Enhance the efficiency and reliability of your electronic circuits with the MC74AC244DTR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and performance in their Bus Driver & Transceivers category. This versatile product is perfect for a wide range of applications, offering seamless integration and optimal transmission speeds. With its advanced technology and superior design, the MC74AC244DTR2 provides unparalleled value, benefits, and advantages to customers looking to elevate their projects to the next level. Upgrade your systems today with Onsemi's exceptional MC74AC244DTR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceivers, making it suitable for various environments.

Propagation Delay At Nominal Supply: 10 ns

The low propagation delay ensures fast signal transmission, making this product ideal for applications requiring quick response times.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving time and effort during the manufacturing process.

No. of Functions: 2

Having multiple functions in one device simplifies circuit design and reduces the overall component count, making it cost-effective and space-efficient.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with common power sources, making integration into existing systems straightforward.

Power Supplies (V): 3.3/5

Supporting a range of power supplies provides flexibility in application design, allowing for compatibility with different systems and voltage requirements.

No. of Terminals: 20

With a sufficient number of terminals, this product offers versatile connectivity options for interfacing with other components and peripherals.

Maximum I (ol): 12 Amp

The high output current capability of 12A enables the driving of high-power loads, expanding the range of applications for this product.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, enhancing the reliability and efficiency of the bus driver and transceivers.

Technical Specifications

Bus Driver & Transceivers MC74AC244DTR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74AC244DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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