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MC33560DTBR2

Onsemi

MC33560DTBR2 by Onsemi

MC33560DTBR2 by Onsemi is a 24-terminal IC with Vsup ranging from 1.8V to 6.6V, operating b/w -40 °C to 85°C. It features a small outline package with dual terminal position and Gull Wing form, suitable for industrial analog circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,046 parts In-Stock

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Digiode

USA . 164 parts In-Stock

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R&J Components

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ACDS - Activité Composants Distribution Service

France . 66 parts In-Stock

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Component Stockers USA

USA . 1,907 parts In-Stock

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$1.070

100+ parts

$1.020

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$0.980

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$1.070

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AZTECH Wire

Italy . 951 parts In-Stock

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$9.820

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951

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Pacific Micro-Tech

USA . 23,000 parts In-Stock

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SupplyDigital Components

Austria . 8,194 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,103 parts In-Stock

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Problanco Electronics

Mexico . 5,436 parts In-Stock

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RC Electronics

USA . 3,870 parts In-Stock

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TANS Electronics

Latvia . 2,403 parts In-Stock

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Kulean Microsystems

USA . 2,044 parts In-Stock

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Kepictronics

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Microchip USA

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Corphita

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Perfect Parts

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Corohmni

South Africa . 117 parts In-Stock

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UHIMA Technologies

Türkiye . 96 parts In-Stock

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Overview

Enhance your electronic designs with the MC33560DTBR2 by Onsemi, a high-quality analog circuit semiconductor that offers superior performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this small outline, thin profile package is perfect for a wide range of applications. With a nominal supply voltage of 4V and a temperature range from -40 °C to 85°C, this product delivers exceptional value and benefits to customers seeking efficient and dependable solutions. Experience the advantages of the MC33560DTBR2 and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for protecting the semiconductor components inside the package.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage: 4 V

Suitable voltage range for various applications, providing flexibility in power requirements.

Maximum Operating Temperature: 85 °C

Capable of operating in high temperature environments, ensuring reliable performance under heat stress.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides good solderability and conductivity for reliable connections.

Width (mm): 5.6 mm

Compact size allows for efficient use of space on the PCB.

Other IC type: ANALOG CIRCUIT

Enables the product to work with analog signals, making it suitable for a wide range of applications.

Peak Reflow Temperature: 235 C

Withstands high reflow temperatures during soldering processes, ensuring proper bonding of components.

Technical Specifications

Other Function Semiconductors MC33560DTBR2 attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.6 mm

Trade Compliance

MC33560DTBR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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