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MC33560ADW

Onsemi

MC33560ADW by Onsemi

MC33560ADW by Onsemi is a 24-terminal IC with Vsup ranging from 1.8V to 6.6V, suitable for industrial applications. It has a temperature range of -40°C to 85°C and peak reflow temp of 235°C. This analog circuit in small outline package is surface mountable and ideal for various functions in electronics.

Median Price

$8.700

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,140 parts In-Stock

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1,140

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Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 2 parts In-Stock

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$8.700

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2

$8.700

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Vyrian

USA . 802 parts In-Stock

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802

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Digiode

USA . 291 parts In-Stock

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Nova Conductors

Japan . 36 parts In-Stock

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Prism Electronics

USA . 30 parts In-Stock

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Ampacity Inc.

Singapore . 735 parts In-Stock

1+ parts

$1.500

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735

$1.500

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Corohmni

South Africa . 2,913 parts In-Stock

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$31.527

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Kulean Microsystems

USA . 7,144 parts In-Stock

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Problanco Electronics

Mexico . 5,017 parts In-Stock

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TANS Electronics

Latvia . 2,959 parts In-Stock

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SupplyDigital Components

Austria . 2,292 parts In-Stock

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UHIMA Technologies

Türkiye . 806 parts In-Stock

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Corphita

USA . 102 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Kepictronics

USA . 97 parts In-Stock

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Perfect Parts

USA . 34 parts In-Stock

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Overview

Looking for a high-quality solution for your analog circuit needs? Look no further than the MC33560ADW by Onsemi. With its industrial-grade temperature grade and peak reflow temperature of 235°C, this small outline package offers reliability and durability. From automotive to industrial applications, this semiconductor provides unmatched performance and functionality. Trust Onsemi's expertise and experience to deliver value and benefits that exceed expectations. Upgrade your projects with the MC33560ADW today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the semiconductor components, ensuring reliability in various environments.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 4 V

Optimal voltage level for efficient operation and performance of the semiconductor device.

No. of Terminals: 24

Sufficient number of terminals for connectivity and integration within complex electronic systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, adding versatility to its application range.

Terminal Finish: TIN LEAD

Provides good solderability and contact reliability, ensuring stable electrical connections.

Width (mm): 7.5 mm

Compact size allows for space-efficient placement on circuit boards, ideal for applications with limited space.

Other IC type: ANALOG CIRCUIT

Incorporates analog circuitry, suitable for applications that require precise and continuous signal processing.

Minimum Supply Voltage (Vsup): 1.8 V

Can operate at low supply voltages, allowing for energy-efficient performance and extending battery life in portable devices.

Terminal Form: GULL WING

Facilitates easy mounting and soldering on circuit boards, enhancing the overall assembly process.

Technical Specifications

Other Function Semiconductors MC33560ADW attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

15.395 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

6.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

MC33560ADW Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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