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MC33039PG

Onsemi

MC33039PG by Onsemi

MC33039PG by Onsemi is an 8-terminal IC with a supply voltage range of 5.5V to 8.25V, ideal for industrial applications. It operates b/w -40°C to 85°C, featuring a package style of IN-LINE and technology type as BIPOLAR. With peak reflow temperature at 260°C, it suits various analog circuit functions efficiently.

Median Price

$0.702

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$0.702

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37

$0.702

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Chip Stock

USA . 36,000 parts In-Stock

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36,000

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Vyrian

USA . 7,468 parts In-Stock

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7,468

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Digiode

USA . 188 parts In-Stock

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188

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 422 parts In-Stock

1+ parts

$0.688

100+ parts

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422

$0.688

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.702

100+ parts

$0.688

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2,000

$0.702

$0.688

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Continental Prestige Electronics

USA . 1,384 parts In-Stock

1+ parts

$0.702

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$0.688

1,384

$0.702

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-

$0.688

Argo Parts USA

USA . 509 parts In-Stock

1+ parts

$0.702

100+ parts

-

1k+ parts

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10k+ parts

$0.681

509

$0.702

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$0.681

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.716

100+ parts

$0.716

1k+ parts

$0.716

10k+ parts

-

600

$0.716

$0.716

$0.716

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Benley Electronics

USA . 1 parts In-Stock

1+ parts

$1.450

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1

$1.450

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Ampacity Inc.

Singapore . 1,424 parts In-Stock

1+ parts

$6.500

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1,424

$6.500

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$17.338

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254

$17.338

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Aztec Data Supply Inc.

USA . 191 parts In-Stock

1+ parts

$23.217

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191

$23.217

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A-Z Elektronik GmbH

Germany . 6,132 parts In-Stock

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6,132

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Kulean Microsystems

USA . 5,978 parts In-Stock

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5,978

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Problanco Electronics

Mexico . 5,324 parts In-Stock

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5,324

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TANS Electronics

Latvia . 3,018 parts In-Stock

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3,018

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 2,354 parts In-Stock

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2,354

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UHIMA Technologies

Türkiye . 777 parts In-Stock

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777

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Lixinc

USA . 743 parts In-Stock

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743

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SupplyDigital Components

Austria . 385 parts In-Stock

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385

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Perfect Parts

USA . 224 parts In-Stock

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224

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Microchip USA

USA . 161 parts In-Stock

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161

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Overview

Unlock the potential of your electronic designs with the MC33039PG by Onsemi. Manufactured with precision and expertise, this high-quality semiconductor offers unparalleled performance in a wide range of applications. From automotive to industrial automation, this versatile product delivers value, reliability, and efficiency to meet your unique needs. Trust Onsemi for cutting-edge technology and superior functionality that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and resilience are important factors.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easier placement and routing on circuit boards, optimizing space and layout efficiency.

Nominal Supply Voltage (Vsup): 6.25 V

With a specific nominal supply voltage of 6.25V, this product offers precise and stable power delivery, ensuring consistent performance in various operating conditions.

Power Supplies (V): 6.25

The 6.25V power supply capability provides a balanced voltage level for the proper functioning of the semiconductor, minimizing the risk of overloading or underpowering.

No. of Terminals: 8

The presence of 8 terminals enhances connectivity options, allowing for versatile integration into different circuit configurations and systems.

Package Style (Meter): IN-LINE

The in-line package style offers a compact and streamlined design, making it suitable for space-constrained applications without compromising on performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperature environments, expanding its range of potential applications.

Minimum Operating Temperature: -40 °C

The impressive minimum operating temperature of -40°C ensures reliable operation even in extremely cold conditions, making it a robust choice for diverse environments.

Terminal Finish: TIN

The TIN terminal finish provides excellent conductivity and corrosion resistance, maintaining signal integrity and prolonging the lifespan of the semiconductor.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved electrical connections, reducing the risk of signal loss or disconnection for enhanced reliability.

Maximum Seated Height: 4.45 mm

The low maximum seated height of 4.45mm enables a more compact overall design, facilitating integration into space-limited devices or applications.

Width (mm): 7.62 mm

The moderate width of 7.62mm strikes a balance between space efficiency and robustness, making it a versatile choice for various electronic designs.

Other IC type: ANALOG CIRCUIT

Featuring an analog circuit design, this product is optimized for applications requiring precise and continuous signal processing, ensuring high fidelity performance.

Minimum Supply Voltage (Vsup): 5.5 V

The minimum supply voltage of 5.5V guarantees stable operation at lower power levels, making it energy-efficient and cost-effective in the long run.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this product can endure the reflow soldering process without compromising its structural integrity, simplifying manufacturing procedures.

Length: 9.78 mm

The length of 9.78mm offers a compact form factor, reducing the footprint of the semiconductor and allowing for efficient use of space in compact designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets rigorous standards for reliability, durability, and performance in demanding environments.

Maximum Supply Current (Isup): 5 mA

The maximum supply current of 5mA ensures efficient power consumption and minimal heat dissipation, making it suitable for low-power devices and systems.

Technology: BIPOLAR

Utilizing bipolar technology, this product delivers fast and precise signal processing, making it ideal for applications requiring high-speed performance and accuracy.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and provides secure connections, ensuring stability and durability in harsh operating conditions.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for easy integration into various PCB layouts and configurations, facilitating installation and maintenance processes.

Maximum Supply Voltage (Vsup): 8.25 V

The high maximum supply voltage of 8.25V ensures compatibility with a wide range of power sources, offering flexibility and versatility in system design and integration.

Technical Specifications

Other Function Semiconductors MC33039PG attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.78 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6.25

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

8.25 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

6.25 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

MC33039PG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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