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MC33039P

Onsemi

MC33039P by Onsemi

MC33039P by Onsemi is an 8-terminal IC with a supply voltage range of 5.5V to 8.25V, suitable for industrial applications. It operates b/w -40°C to 85°C and has a max seated height of 4.45mm, making it ideal for analog circuit designs in various electronic systems.

Median Price

$2.570

Lifecycle Status

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18

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Forefront Electronics and Design

USA . 27 parts In-Stock

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$2.450

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Component Electronics Inc.

Canada . 120 parts In-Stock

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LIBRA Elektronik GmbH

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ComSIT Distribution GmbH

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R&J Components

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Sunrise Surplus Inc.

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First Choice Components Inc.

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J & M Industries LLC

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ACDS - Activité Composants Distribution Service

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Benley Electronics

USA . 2 parts In-Stock

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$1.900

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Corohmni

South Africa . 101 parts In-Stock

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$2.450

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Ampacity Inc.

Singapore . 394 parts In-Stock

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$3.500

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Aztec Data Supply Inc.

USA . 4,212 parts In-Stock

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$15.243

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AZTECH Wire

Italy . 511 parts In-Stock

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$18.950

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QUARKTWIN TECHNOLOGY LTD

USA . 28,047 parts In-Stock

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Lixinc

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Metaverse IC Inc.

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A-Z Elektronik GmbH

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Problanco Electronics

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Argo Parts USA

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Kulean Microsystems

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TANS Electronics

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SupplyDigital Components

Austria . 2,083 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Singapore . 300 parts In-Stock

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New Zealand . 300 parts In-Stock

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Microchip USA

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Australia . 50 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the MC33039P by Onsemi, a premium quality analog circuit that offers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this rectangular package semiconductor is designed for industrial applications, providing a wide supply voltage range and optimal operating temperatures. With its 8 terminals and through-hole terminal form, the MC33039P is versatile and easy to integrate into your projects. Experience the value and benefits of this high-quality product, trusted by professionals worldwide for its superior performance and durability. Elevate your designs with the MC33039P by Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the semiconductor, making it suitable for a variety of environments.

Nominal Supply Voltage (Vsup): 6.25 V

The nominal supply voltage of 6.25 V ensures stable and reliable operation of the semiconductor.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this semiconductor can withstand high temperature environments without compromising performance.

Technology: BIPOLAR

The use of bipolar technology in this semiconductor ensures efficient and accurate signal processing.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy and secure connection of the semiconductor to circuit boards, ensuring reliable performance.

Technical Specifications

Other Function Semiconductors MC33039P attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.78 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

6.25

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

8.25 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

6.25 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

MC33039P Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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